MANUFACTURING HOUSINGS - HEWLETT PACKARD DEVELOPMENT CO LP

Title:

MANUFACTURING HOUSINGS

Document Type and Number:

WIPO Patent Application WO/2017/020294

Kind Code:

A1

Abstract:

Various examples of the present disclosure provide a method of manufacturing a housing of an electronic device. A metal plate (201) may be placed over a mold (202) having a shape, and thermoformed to attach the metal plate (201) to the mold(202) to form a metal layer (203) with the shape. A plastic plate (204) may be placed over the metal layer (203) when a first side of the metal layer (203) is attached to the mold (202), and thermoformed to adhere to a second side of the metal layer (203) to form a plastic layer (205) on the metal layer (203). The metal layer (203) with the plastic layer (205) is taken down from the mold (202) to get the housing of the electronic device.

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Inventors:

WU KUAN-TING (CN)
YANG CHIENLUNG (US)
CHANG CHI-HAO (CN)

Application Number:

PCT/CN2015/086232

Publication Date:

February 09, 2017

Filing Date:

August 06, 2015

Export Citation:

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Assignee:

HEWLETT PACKARD DEVELOPMENT CO LP (US)
WU KUAN-TING (CN)
YANG CHIENLUNG (US)
CHANG CHI-HAO (CN)

International Classes:

B32B15/08

Foreign References:

JPS60176300A	1985-09-10
CN101730410A	2010-06-09
CN1689842A	2005-11-02
CN1474742A	2004-02-11
CN1150774A	1997-05-28
CN1887598A	2007-01-03

Attorney, Agent or Firm:

DEQI INTELLECTUAL PROPERTY LAW CORPORATION (CN)

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