Title:
MANUFACTURING METHOD FOR ADHERED MATERIAL, MANUFACTURING METHOD FOR SUBSTRATE HAVING ADHESIVE PATTERN, AND SUBSTRATE HAVING ADHESIVE PATTERN
Document Type and Number:
WIPO Patent Application WO/2012/105658
Kind Code:
A1
Abstract:
A manufacturing method for an adhered material in which a first adherend and a second adherend are bonded via an adhesive pattern, said manufacturing method comprising: a step in which an adhesive layer is provided on the first adherend; a step in which an adhesive pattern is formed by etching the adhesive later after predetermined sections of the surface of the adhesive layer opposite to the surface in contact with the first adherend are provided with a protective layer which protects against etching; and a step in which the second adherend is bonded to the adhesive pattern after the removal of the protective layer.
Inventors:
IKEDA AYA (JP)
FUJII SHINJIRO (JP)
MASUKO TAKASHI (JP)
KAWAMORI TAKASHI (JP)
FUJII SHINJIRO (JP)
MASUKO TAKASHI (JP)
KAWAMORI TAKASHI (JP)
Application Number:
PCT/JP2012/052421
Publication Date:
August 09, 2012
Filing Date:
February 02, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
IKEDA AYA (JP)
FUJII SHINJIRO (JP)
MASUKO TAKASHI (JP)
KAWAMORI TAKASHI (JP)
IKEDA AYA (JP)
FUJII SHINJIRO (JP)
MASUKO TAKASHI (JP)
KAWAMORI TAKASHI (JP)
International Classes:
H01L21/52; C09J5/00; C09J7/35; C09J201/00; H01L23/02; H01L27/14
Foreign References:
| JPH0940931A | 1997-02-10 | |||
| JP2009158713A | 2009-07-16 | |||
| JP2005330300A | 2005-12-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: