Title:
MANUFACTURING METHOD FOR ASSEMBLY OF CAPACITANCE TYPE TOUCH PANEL, AND DISPLAY DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2013/018698
Kind Code:
A1
Abstract:
Provided is a manufacturing method for an assembly of a capacitance type touch panel that allows easy manufacturing of a touch panel film of a predetermined shape from film materials for a capacitance type panel. The present invention includes the following steps: a touch panel film forming step (S7) for forming a first intermediate touch panel film by applying a forming process to a film material for a touch panel in which a first conductive pattern and a second conductive pattern are formed on a transparent or semi-transparent film; and a touch panel film trimming step (S8) for applying a trimming process to the first intermediate touch panel film after the touch panel film forming step (S7). In the touch panel film trimming step (S8), a second intermediate touch panel film is formed by applying a trimming process to the first intermediate touch panel film.
Inventors:
FUTAMATA KEIGO (JP)
Application Number:
PCT/JP2012/069145
Publication Date:
February 07, 2013
Filing Date:
July 27, 2012
Export Citation:
Assignee:
SHIMADA PREC CO LTD (JP)
FUTAMATA KEIGO (JP)
FUTAMATA KEIGO (JP)
International Classes:
G06F3/041; G06F3/044
Domestic Patent References:
| WO2010058829A1 | 2010-05-27 |
Foreign References:
| JP2009130283A | 2009-06-11 | |||
| JP2001162619A | 2001-06-19 | |||
| JP2010086530A | 2010-04-15 | |||
| JP2010214601A | 2010-09-30 | |||
| JPS62154413A | 1987-07-09 |
Attorney, Agent or Firm:
KISHIMOTO Tadaaki et al. (JP)
Tadaaki Kishimoto (JP)
Tadaaki Kishimoto (JP)
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