Title:
MANUFACTURING METHOD FOR CONTACT FOR CURRENT INSPECTION JIG, CONTACT FOR CURRENT INSPECTION JIG MANUFACTURED USING SAID METHOD, AND CURRENT INSPECTION JIG PROVIDED WITH SAID CONTACT
Document Type and Number:
WIPO Patent Application WO/2011/099371
Kind Code:
A1
Abstract:
Disclosed is a manufacturing method which enables more accurate and precise manufacturing of an ultra-fine, thin contact for current inspection jigs which is provided with a spring structure. After a metal or gold alloy plating layer is formed by plating the outer periphery of a core material, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer.
Inventors:
KOJIMA KESAO (JP)
ICHIKAWA YUTAKA (JP)
ICHIKAWA YUTAKA (JP)
Application Number:
PCT/JP2011/051560
Publication Date:
August 18, 2011
Filing Date:
January 27, 2011
Export Citation:
Assignee:
LUZCOM INC (JP)
KOJIMA KESAO (JP)
ICHIKAWA YUTAKA (JP)
KOJIMA KESAO (JP)
ICHIKAWA YUTAKA (JP)
International Classes:
G01R1/067; C23F1/02; C25D1/02
Foreign References:
| JP2008025833A | 2008-02-07 | |||
| JP2004115838A | 2004-04-15 | |||
| JP2009160722A | 2009-07-23 | |||
| JP2008025833A | 2008-02-07 | |||
| JP2004115838A | 2004-04-15 | |||
| JP2009160722A | 2009-07-23 |
Other References:
See also references of EP 2535726A4
Attorney, Agent or Firm:
SUZUKI Shoji et al. (JP)
Shoji Suzuki (JP)
Shoji Suzuki (JP)
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Claims: