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Title:
MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/084304
Kind Code:
A1
Abstract:
The present invention is a manufacturing method for a semiconductor device, wherein a template, which has multiple flow paths for delivering a treatment liquid to a substrate, said substrate having multiple through-holes penetrating in the thickness direction thereof, and which has multiple electrodes which are provided on the flow paths, is positioned such that the multiple flow paths are aligned with the multiple through-holes, the treatment liquid is supplied into the multiple through-holes through the multiple flow paths, and a voltage is applied by using electrodes on one side among the multiple electrodes as positive electrodes, and electrodes on the other side as negative electrodes, in order to apply a predetermined treatment to the substrate. Consequently, throughput of the manufacturing process can be improved while reducing the manufacturing cost of the semiconductor device.

Inventors:
IWATSU HARUO (JP)
MATSUMOTO TOSHIYUKI (JP)
Application Number:
PCT/JP2013/082032
Publication Date:
June 05, 2014
Filing Date:
November 28, 2013
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3205; C25D7/12; H01L21/768; H01L21/8238; H01L23/12; H01L23/522; H01L27/06; H01L27/092
Domestic Patent References:
WO2012050057A12012-04-19
WO2011158698A12011-12-22
WO2012173238A12012-12-20
WO2013021847A12013-02-14
Foreign References:
JP2003253485A2003-09-10
JP2005303319A2005-10-27
JP2005005331A2005-01-06
JP2013041896A2013-02-28
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
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