Title:
MANUFACTURING METHOD FOR ELECTROMAGNETIC SHIELDING SHEET AND CIRCUIT BOARD WITH ELECTROMAGNETIC SHIELDING SHEET
Document Type and Number:
WIPO Patent Application WO/2013/108849
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic shielding sheet which is bonded to a circuit board with signal wiring. The electromagnetic shielding sheet includes a bonding layer containing a thermosetting resin composition having a glass transition temperature of 0-150ºC and having fluid insulating properties under 1 kg/cm2 of pressure at 150ºC, and a conductive layer provided on one side of the bonding layer having a plurality of openings. Because the electromagnetic shielding sheet of the present invention can be bonded to a circuit board without using a conductive bonding agent, the thickness of the electromagnetic shielding sheet bonded to a circuit board to create a circuit board with an electromagnetic shielding sheet can be reduced.
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Inventors:
MATSUZAWA TAKAHIRO (JP)
KOBAYASHI HIDENOBU (JP)
KOBAYASHI HIDENOBU (JP)
Application Number:
PCT/JP2013/050835
Publication Date:
July 25, 2013
Filing Date:
January 17, 2013
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
H05K9/00; H01Q17/00; H05K1/02
Foreign References:
| JP2009206188A | 2009-09-10 | |||
| JPH05235495A | 1993-09-10 | |||
| JPH05343820A | 1993-12-24 | |||
| JPH04101316U | 1992-09-01 | |||
| JP2011114100A | 2011-06-09 | |||
| JP2004095566A | 2004-03-25 | |||
| JPH11298186A | 1999-10-29 | |||
| JP2009096939A | 2009-05-07 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
Morning ratio One husband (JP)
Morning ratio One husband (JP)
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Claims: