Title:
MANUFACTURING METHOD FOR ELECTRONIC COMPONENT MODULE, AND ELECTRONIC COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2012/093690
Kind Code:
A1
Abstract:
The present invention provides a manufacturing method for an electronic component module and an electronic component module capable of reducing thickness even when a burr of a conductive resin, a protrusion of a conductive resin or the like is made in a shield layer. The present invention comprises: sealing a surface of a collective substrate (10) having a plurality of electric elements mounted thereon with a sealing resin; and cutting into the whole of a part of the collective substrate (10) at a boundary of electronic component modules (100) from the top surface of a sealing resin (14) up to a position to be cut so as to form a first trench (21). The present invention further comprises: covering the top surface of the sealing resin (14) with the conductive resin; filling the first trench (21) with the conductive resin so as to form a shield layer (15); forming a concave part (19) in the shield layer (15) at a position where the first trench (21) is formed; cutting into the whole or a part of the collective substrate (10) at the boundary of the electronic component modules (100) from the top surface side of the sealing resin (14) up to the position to be cut along the concave part (19); forming a second trench (22) having a width smaller than the concave part (19); and forming pieces of the electronic component modules.
Inventors:
KANRYO KOICHI (JP)
KATSUBE AKIO (JP)
KITAMURA SHUNSUKE (JP)
KATSUBE AKIO (JP)
KITAMURA SHUNSUKE (JP)
Application Number:
PCT/JP2012/050094
Publication Date:
July 12, 2012
Filing Date:
January 05, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
KANRYO KOICHI (JP)
KATSUBE AKIO (JP)
KITAMURA SHUNSUKE (JP)
KANRYO KOICHI (JP)
KATSUBE AKIO (JP)
KITAMURA SHUNSUKE (JP)
International Classes:
H01L21/56; H01L23/28; H01L25/00; H05K1/02; H05K3/00; H05K9/00
Domestic Patent References:
| WO2009144960A1 | 2009-12-03 |
Foreign References:
| JP2003007652A | 2003-01-10 | |||
| JP2007335424A | 2007-12-27 | |||
| JPH04188848A | 1992-07-07 |
Attorney, Agent or Firm:
FUKUNAGA Masaya (JP)
Masaya Fukunaga (JP)
Masaya Fukunaga (JP)
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Claims: