Title:
MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2006/022072
Kind Code:
A1
Abstract:
A manufacturing method of an electronic component having an electronic component element bonded and secured onto a substrate using conductive adhesive, which provides an electronic component exhibiting excellent reliability in electrical connection and mechanical bonding at the joint regardless of ambient temperature variation. In the manufacturing method of an electronic component where an electronic component element (1C) is bonded and secured onto a substrate (12) having a plurality of electrode lands (11a, 11b) using conductive adhesive, first conductive adhesive (7, 8) is applied to a region larger than the area of bonding interface at the joint of the electronic component element (1C) by the first conductive adhesive and then it is hardened. Subsequently, unnecessary part of the first conductive adhesive (7, 8) is removed and the electronic component element (1C) is bonded to the electrode lands (11a, 11b) using second conductive adhesive (14, 15).
Inventors:
TAKATA MASACHIKA (JP)
Application Number:
PCT/JP2005/011443
Publication Date:
March 02, 2006
Filing Date:
June 22, 2005
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
TAKATA MASACHIKA (JP)
TAKATA MASACHIKA (JP)
International Classes:
H01L21/60; H01L41/22; H03H3/04; H03H9/02; H03H9/08; (IPC1-7): H01L21/60; H01L41/22; H03H3/04; H03H9/02; H03H9/08
Foreign References:
| JPH0730357A | 1995-01-31 | |||
| JPH06191887A | 1994-07-12 | |||
| JP2001127578A | 2001-05-11 | |||
| JP2002057544A | 2002-02-22 |
Attorney, Agent or Firm:
Miyazaki, Chikara (5-4 Tanimachi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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