Title:
MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/180868
Kind Code:
A1
Abstract:
In one aspect of this manufacturing method for an electronic component, a first metal layer is formed on a substrate, a second metal layer is formed on the first metal layer, a mask made of an organic resin layer is formed on the second metal layer, the second metal layer is plasma-etched through the mask using a reaction gas including fluorine to form a recess in the multilayer film constituted of the organic resin layer and the second metal layer, the internal surface of the recess is subjected to oxygen ashing, and after the oxygen ashing, a third metal layer is formed in the recess by electroplating.
Inventors:
HIRONIWA DAISUKE (JP)
KURIMOTO TAKASHI (JP)
UEDA MASAHISA (JP)
KURIMOTO TAKASHI (JP)
UEDA MASAHISA (JP)
Application Number:
PCT/JP2018/011362
Publication Date:
October 04, 2018
Filing Date:
March 22, 2018
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
H01L21/768; C23F1/12; C23F4/00; C25D5/34; H01L21/3065; H01L21/3205; H01L23/12; H01L23/522
Foreign References:
| JP2009177152A | 2009-08-06 | |||
| JP2002212779A | 2002-07-31 | |||
| JPH1154460A | 1999-02-26 | |||
| JPH04196429A | 1992-07-16 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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