Title:
MANUFACTURING METHOD FOR METAL LATTICE, AND METAL LATTICE
Document Type and Number:
WIPO Patent Application WO/2012/008119
Kind Code:
A1
Abstract:
In the disclosed metal lattice (DG) and the manufacturing method for the same, slit grooves are formed, by means of dry etching, in p-type silicon sections (12a) attached to an n-type silicon layer (11) so as to at least reach the n-type silicon layer (11). By means of electroforming the slit grooves are buried into metal and metallic sections (12b) are formed. Thus, a metal lattice (DG) having such a structure, and the manufacturing method for the same use a silicon substrate and enable the metallic sections of a lattice to be formed with greater fine detail by means of electroforming.
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Inventors:
YOKOYAMA, Mitsuru (Inc. 1, Sakura-machi, Hino-sh, Tokyo 11, 〒1918511, JP)
Application Number:
JP2011/003853
Publication Date:
January 19, 2012
Filing Date:
July 06, 2011
Export Citation:
Assignee:
KONICA MINOLTA MEDICAL & GRAPHIC, INC. (1 Sakura-machi, Hino-shi Tokyo, 11, 〒1918511, JP)
コニカミノルタエムジー株式会社 (〒11 東京都日野市さくら町１番地 Tokyo, 〒1918511, JP)
コニカミノルタエムジー株式会社 (〒11 東京都日野市さくら町１番地 Tokyo, 〒1918511, JP)
International Classes:
C25D7/00; A61B6/00; A61B6/06; C25D5/02; G01N23/04; G01T7/00
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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Claims:
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