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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR METALLIC LATTICE, AND METALLIC LATTICE
Document Type and Number:
WIPO Patent Application WO/2012/008118
Kind Code:
A1
Abstract:
In the disclosed metallic lattice (DG) and the manufacturing method for the same, slit grooves are formed, by means of dry etching, in second silicon sections (12a) which are attached to a first silicon layer (11) and which have a higher resistance than the first silicon layer (11), said grooves being formed so as to at least reach the first silicon layer (11), and, by means of electroforming, the slit grooves are filled with metal to form metallic sections (12b). Thus, the metallic lattice (DG) having such a structure, and the manufacturing method for the same, use a silicon substrate and enable the metallic sections of a lattice to be formed with greater fine detail by means of electroforming.

Inventors:
YOKOYAMA, Mitsuru (Inc. 1, Sakura-machi, Hino-sh, Tokyo 11, 〒1918511, JP)
Application Number:
JP2011/003851
Publication Date:
January 19, 2012
Filing Date:
July 06, 2011
Export Citation:
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Assignee:
KONICA MINOLTA MEDICAL & GRAPHIC, INC. (1 Sakura-machi, Hino-shi Tokyo, 11, 〒1918511, JP)
コニカミノルタエムジー株式会社 (〒11 東京都日野市さくら町1番地 Tokyo, 〒1918511, JP)
International Classes:
C25D7/00; A61B6/00; A61B6/06; C25D5/02; G01N23/04; G01T7/00
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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Claims: