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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR MICRONEEDLE ARRAY
Document Type and Number:
WIPO Patent Application WO/2019/163805
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a manufacturing method for a microneedle array that enables a medicine to be concentrated on the needle tips of the microneedle array. According to this invention, the manufacturing method for a microneedle array includes a step of filling a hydrophobic mold with a medicine-containing liquid and forming needle part tip sections, and a step of filling the mold containing the formed needle part tip sections with a liquid containing a water soluble polymer or a disaccharide and forming needle part base sections and a sheet part. The medicine-containing liquid contains 0.01 to 5 mg/mL of a surfactant.

Inventors:
SHIMADA TOSHIO (JP)
KABATA KOKI (JP)
Application Number:
PCT/JP2019/006230
Publication Date:
August 29, 2019
Filing Date:
February 20, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
A61M37/00
Domestic Patent References:
WO2016143792A12016-09-15
Foreign References:
JP2009233170A2009-10-15
JP2017517295A2017-06-29
US20120027810A12012-02-02
Attorney, Agent or Firm:
SIKS & CO. (JP)
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