MANUFACTURING METHOD FOR MULTILAYER PRINTED WIRING BOARD

WIPO Patent Application WO/2019/022101

A1

This manufacturing method for a multilayer printed wiring board makes it possible to alleviate warping in a case where the multilayer printed wiring board is manufactured by adding an insulating layer and a metal foil onto conductor wiring of a printed wiring board, even with warping where the conductor wiring-side surface of the printed wiring board protrudes. A first layered member is fabricated by layering a first metal foil 21, a second metal foil 22, and a first prepreg 31 so as to be interposed between the first metal foil and the second metal foil, and the layered member is thermally pressed to thermally cure the first prepreg, thereby manufacturing a double-sided metal-clad layered board 7. A portion of the first metal foil is removed from the double-sided metal-clad layered board 7 to fabricate conductor wiring 51 and manufacture a printed wiring board 1. A third metal foil 23 is preliminarily heated, and then the conductor wiring 51 of the printed wiring board 1, a third metal foil 23, and a second prepreg 32 are layered such that the second prepreg is interposed between the conductor wiring and the third metal foil and then heat pressed. The linear expansion coefficient of a first insulating layer 41 is less than the linear expansion coefficients of the first metal foil 21 and the second metal foil 22.

MATSUMURA KAZUKI
ISHIKAWA YOHSUKE
KISHINO KOJI

PCT/JP2018/027794

January 31, 2019

July 25, 2018

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PANASONIC IP MAN CO LTD (JP)

H05K3/46; B29C43/20; B29C70/40

JP2014111361A	2014-06-19
JPS6189037A	1986-05-07
JP2013135229A	2013-07-08

HOKUTO PATENT ATTORNEYS OFFICE (JP)

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