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Title:
MANUFACTURING METHOD FOR OPTICAL SEMICONDUCTOR ELEMENTS HAVING PHOSPHOR LAYERS AND SEALING LAYERS
Document Type and Number:
WIPO Patent Application WO/2016/178397
Kind Code:
A1
Abstract:
This manufacturing method for optical semiconductor elements having phosphor layers and sealing layers, comprises: an element arrangement step for arranging a plurality of optical semiconductor elements at one side in the thickness direction of a phosphor sheet so as to be spaced from one another; a first cutting step for cutting the phosphor sheet between the plurality of optical semiconductor elements so as to form gaps penetrating the phosphor sheet in the thickness direction, to form a plurality of phosphor layers corresponding to the plurality of optical semiconductor elements, respectively; a sheet forming step for forming a sealing sheet so as to fill the gaps and cover side surfaces of the optical semiconductor elements; and a second cutting step for cutting the sealing sheet in the thickness direction to form a plurality of sealing layers corresponding to the plurality of optical semiconductor elements and the plurality of phosphor layers, respectively.

Inventors:
KONO HIROKI (JP)
OOYABU YASUNARI (JP)
CHOU YI-MIN (TW)
Application Number:
PCT/JP2016/063216
Publication Date:
November 10, 2016
Filing Date:
April 27, 2016
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/29; H01L33/52; H01L23/31; H01L33/50
Domestic Patent References:
WO2013137356A12013-09-19
Foreign References:
JP2014168033A2014-09-11
JP2014130918A2014-07-10
JP2012222319A2012-11-12
JP2014139979A2014-07-31
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
Hiroyuki Okamoto (JP)
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