Title:
MANUFACTURING METHOD FOR ORGANIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/198655
Kind Code:
A1
Abstract:
A manufacturing method for an organic device 1 includes: a forming step for forming a plurality of organic device parts 10 with predetermined intervals therebetween on one main surface 3a of a support substrate 3 that extends in one direction, each organic device part having at least a first electrode layer 5, an organic functional layer 7, and a second electrode layer 9 laminated in this order; a bonding step for bonding, along the one direction, a sealing member 11 that extends in the one direction, such that a part of the first electrode layer 5 and a part of the second electrode layer 9 in each organic device part 10 are respectively exposed, and such that the sealing member straddles the plurality of organic device parts 10; and a cutting step for dividing the organic device parts 10 into individual pieces. In the cutting step, cutting blades B enter from the other main surface 3b side of the support substrate 3 in a state where the sealing member 11 and regions of the one main surface 3a of the support substrate 3 where the sealing member 11 is not bonded are supported by a support body 100 abutting the sealing member 11 and the regions.
Inventors:
FUJII TAKASHI (JP)
MATSUMOTO YASUO (JP)
MORISHIMA SHINICHI (JP)
MATSUMOTO YASUO (JP)
MORISHIMA SHINICHI (JP)
Application Number:
PCT/JP2018/013010
Publication Date:
November 01, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
H05B33/10; B26D7/20; B26F1/44; H01L51/50; H05B33/04
Domestic Patent References:
| WO2007034647A1 | 2007-03-29 | |||
| WO2016017807A1 | 2016-02-04 | |||
| WO2014065248A1 | 2014-05-01 | |||
| WO2010067721A1 | 2010-06-17 |
Foreign References:
| JP2008077854A | 2008-04-03 |
Other References:
See also references of EP 3618576A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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