Title:
MANUFACTURING METHOD FOR PATTERNED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/138823
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a manufacturing method for a patterned substrate by which extreme ultraviolet ray or electron beam lithography can be performed with high sensitivity, a resist pattern with superior resolution and collapse suppression can be formed, and in addition, a favorable substrate pattern can be obtained. This manufacturing method for a patterned substrate comprises: a step for coating a surface treatment agent on a surface of a substrate, which contains a metal element in at least one surface layer, the coated surface being the surface containing the metal element; a step for coating a resist composition on the surface coated with the surface treatment agent; a step for exposing the resist film formed in the resist composition coating step with extreme ultraviolet rays or an electron beams; a step for developing the exposed resist film; and a step for etching the substrate while using, as a mask, the resist pattern formed in the developing step. The surface treatment agent includes a polymer having a group containing a polar group on at least one terminating end of the main chain, and a solvent.
Inventors:
SERIZAWA RYUICHI (JP)
SATOU NOZOMI (JP)
OOTSUBO YUUSUKE (JP)
SATOU NOZOMI (JP)
OOTSUBO YUUSUKE (JP)
Application Number:
PCT/JP2018/046876
Publication Date:
July 18, 2019
Filing Date:
December 19, 2018
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/11; C08F8/00; G03F7/038; G03F7/039; G03F7/20; G03F7/40; H01L21/027
Domestic Patent References:
| WO2015163195A1 | 2015-10-29 | |||
| WO2013141015A1 | 2013-09-26 | |||
| WO2012133597A1 | 2012-10-04 |
Foreign References:
| JPH11223941A | 1999-08-17 | |||
| JP2015219246A | 2015-12-07 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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