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Title:
MANUFACTURING METHOD OF PURE COPPER PLATES, AND PURE COPPER PLATE
Document Type and Number:
WIPO Patent Application WO/2011/078188
Kind Code:
A1
Abstract:
Disclosed is a simple method for manufacturing pure copper plates which does not involve cold forging or cold pressing after hot forging or hot pressing, or heat processing thereafter; also disclosed is the finely uniform pure copper plate which is obtained by said method, has low residual stress and excellent processability, and is especially suitable as a copper sputtering target material. Pure copper ingots of purity no less than 99.96 wt% are heated to 550-800°C, and after hot pressing with a total press rates of 85% or more and a temperature at press completion of 500-700°C, are quenched at a cooling rate of 200-1000°C/min until the temperature reaches 200°C or less from the aforementioned temperature at press completion.

Inventors:
SAKAI, Toshihiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-ku, Sakai-Sh, Osaka 06, 〒5900906, JP)
酒井 俊寛 (〒06 大阪府堺市堺区三宝町8-374 三菱伸銅株式会社 三宝製作所内 Osaka, 〒5900906, JP)
TAKEDA, Takahiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-k, Sakai-Shi Osaka 06, 〒5900906, JP)
竹田 隆弘 (〒06 大阪府堺市堺区三宝町8-374 三菱伸銅株式会社 三宝製作所内 Osaka, 〒5900906, JP)
KITA, Koichi (Central Research Institute 1975-2, Shimoishitokami, Kitamoto-sh, Saitama 22, 〒3640022, JP)
Application Number:
JP2010/073045
Publication Date:
June 30, 2011
Filing Date:
December 21, 2010
Export Citation:
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Assignee:
MITSUBISHI SHINDOH CO., LTD. (4-7-35, Kitashinagawa Shinagawa-k, Tokyo 50, 〒1408550, JP)
三菱伸銅株式会社 (〒50 東京都品川区北品川4-7-35 Tokyo, 〒1408550, JP)
MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目3番2号 Tokyo, 〒1008117, JP)
SAKAI, Toshihiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-ku, Sakai-Sh, Osaka 06, 〒5900906, JP)
酒井 俊寛 (〒06 大阪府堺市堺区三宝町8-374 三菱伸銅株式会社 三宝製作所内 Osaka, 〒5900906, JP)
TAKEDA, Takahiro (Sambo Plant, 8-374, Sambo-Cho, Sakai-k, Sakai-Shi Osaka 06, 〒5900906, JP)
International Classes:
C22F1/08; B21B1/38; B21B3/00; C23C14/34; C22F1/00
Attorney, Agent or Firm:
AOYAMA, Masakazu (Seiyo Patent Office, 701 Akiba Bldg., 3-3, Akihabara, Taito-k, Tokyo 06, 〒1100006, JP)
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