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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR REINFORCED COVER GLASS, AND REINFORCED COVER GLASS
Document Type and Number:
WIPO Patent Application WO/2014/013996
Kind Code:
A1
Abstract:
 The purpose of the present invention is to provide a manufacturing method for a reinforced cover glass having greater strength than conventional glass, a reinforced cover glass, a manufacturing method for a reinforced cover glass having an integrated touch sensor, and a reinforced cover glass having an integrated touch sensor. In the manufacturing method for a reinforced cover glass according to the present invention: first, a raw glass sheet is cut into a glass sheet (10) of a desired size (cutting step); the end surface (10c) of the glass sheet (10) is polished by a polishing means (polishing step), thus removing flaws in the end surface (10c) which can cause cracks, and reducing the roughness of the end surface (10c). Next, the glass sheet (10) is chemically reinforced by means of a chemical reinforcement method (chemical reinforcement step). Subsequently, the end surface (10c) of the glass sheet (10) is etched (etching step). The manufacturing method for a reinforced cover glass according to the present invention includes the polishing step prior to the etching step, and thus the entirety of the end surface (10c) can be uniformly etched. Therefore, the manufacturing method for a reinforced cover glass according to the present invention enables a reinforced cover glass (10) that has greater bending strength than conventional glass to be obtained.

Inventors:
KASHIMA IZURU (JP)
Application Number:
PCT/JP2013/069324
Publication Date:
January 23, 2014
Filing Date:
July 16, 2013
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03C21/00; B24B9/00; B24B9/10; C03C15/00; C03C19/00; G06F3/041
Domestic Patent References:
WO2012093525A12012-07-12
WO2009078406A12009-06-25
WO2009157297A12009-12-30
Foreign References:
JP2005285276A2005-10-13
JP2009208983A2009-09-17
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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