Title:
MANUFACTURING METHOD FOR RELIEF PATTERN FORMING BODY AND IMPRINT APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/148118
Kind Code:
A1
Abstract:
Provided is a manufacturing method for a relief pattern forming body wherein mounting and dismounting of a mold with respect to a roll is easy, a mold released from the roll can be reused, and there is no need to perform transfer operations and curing operations simultaneously. The manufacturing method for the relief pattern forming body according to the present invention comprises (1) winding and maintaining a film mold having a relief pattern on a surface thereof on a roll in a state capable of being mounted and dismounted, (2) loading a transfer target onto a substrate loading portion, the transfer target comprising a transfer target resin layer, (3) rotating the roll, while contacting the surface of the transfer target resin layer with the film mold, to separate the film mold from the roll and wind for winding out onto the transfer target resin layer and to transfer the relief pattern of the surface of the film mold onto the transfer target resin layer, (4) curing the transfer target resin layer, and (5) rotating the roll, while contacting the roll with the film mold stacked on the cured transfer target resin layer, to separate the film mold from the cured transfer target resin layer and to wind it up on the roll.
Inventors:
MIZUKAMI YUTAKA (JP)
Application Number:
PCT/JP2016/058060
Publication Date:
September 22, 2016
Filing Date:
March 15, 2016
Export Citation:
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
B29C59/02; H01L21/027
Domestic Patent References:
| WO2011017074A1 | 2011-02-10 |
Foreign References:
| JP2013121713A | 2013-06-20 | |||
| JP2014097599A | 2014-05-29 | |||
| JP2010005866A | 2010-01-14 | |||
| JP2014226877A | 2014-12-08 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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