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Title:
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2019/151260
Kind Code:
A1
Abstract:
Disclosed is a manufacturing method for a semiconductor device, the method comprising a step for preparing a semiconductor wafer that has an adhesive film in which the adhesive film and a semiconductor wafer are provided in the stated order on a self-adhesive film, a dicing step for dicing the semiconductor wafer that has the adhesive-film and obtaining semiconductor chips that have the adhesive film, and a compression-bonding step for compression-bonding the semiconductor chips that have the adhesive film to a semiconductor substrate. The adhesive film includes a first film and a second film in the stated order from the self-adhesive film, the second film having a 80°C shear viscosity that differs from that of the first film, and the 80°C shear viscosity of the second film being 500 Pa•s or greater.

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Inventors:
KUNITO Yui (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
YAMAMOTO Kazuhiro (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
TANIGUCHI Kouhei (9-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 06, 〒1006606, JP)
Application Number:
JP2019/003010
Publication Date:
August 08, 2019
Filing Date:
January 29, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL COMPANY, LTD. (9-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 06, 〒1006606, JP)
International Classes:
H01L21/52; B32B27/00; C09J7/30; H01L21/301; H01L25/065; H01L25/07; H01L25/18
Foreign References:
JP2010254763A2010-11-11
JP2013256574A2013-12-26
JP2008274259A2008-11-13
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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