Title:
MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2011/105255
Kind Code:
A1
Abstract:
Disclosed is a manufacturing method for semiconductor wafer whereby pure water not containing free abrasives is supplied during all treatment stages carried out by machining, except for polishing treatment, which results in reduced quantities of abrasives in waste processing liquid emitted from each stage and also semiconductor scrap recovery from the used slurry and the reuse thereof.
Inventors:
HASHII Tomohiro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
橋井 友裕 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
KAKIZONO Yuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
橋井 友裕 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
KAKIZONO Yuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
Application Number:
JP2011/053193
Publication Date:
September 01, 2011
Filing Date:
February 16, 2011
Export Citation:
Assignee:
SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
HASHII Tomohiro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
橋井 友裕 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
HASHII Tomohiro (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
橋井 友裕 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
International Classes:
H01L21/304; B24B27/06; B24B37/04; B24B57/00
Attorney, Agent or Firm:
ABE Itsurou (ABE International Patent Office, Complete Sakaimachi BLDG. 4039-6, Sakaimachi 1-chome, Kokurakita-k, Kitakyushu-shi Fukuoka 05, 〒8020005, JP)
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Claims: