MANUFACTURING METHOD FOR SPEAKER DIAPHRAGM, SPEAKER DIAPHRAGM, AND SPEAKER

WIPO Patent Application WO/2023/166875

A1

Provided is a manufacturing method for a speaker diaphragm, a speaker diaphragm, and a speaker whereby, even when a hole is opened, insulation properties can be ensured, and rigidity can also be ensured. The method for manufacturing a speaker diaphragm according to the present invention is a method for manufacturing a speaker diaphragm including: a conductive layer (21) that includes a through-hole (31) for passing a tinsel wire; and resin layers (22) disposed so as to sandwich the conductive layer (21). The method comprises: a first step for providing the through-hole (31) in the conductive layer (21); and a second step for closing a mold (30) provided with a convex punch (P) having a diameter smaller than that of the through-hole (31), thereby causing the punch (P) to press the resin layers (22) against a laminate (M1) on an inner side of the through-hole (31). In the second step, due to the pressing of the punch (P), leaked material (40) of the resin layers (22) flows in an inside surface direction of the through-hole (31), and flows into a void portion near an outside surface of the punch (P).

INAGAKI KAZUYUKI (JP)
KUROYANAGI KAZUSHI (JP)

PCT/JP2023/001389

September 07, 2023

January 18, 2023

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JVCKENWOOD CORP (JP)

H04R31/00; B29C43/20; H04R7/02

WO2014162472A1	2014-10-09
WO2016170595A1	2016-10-27
WO2007135745A1	2007-11-29

JPS6135497U	1986-03-04
JPH0286299A	1990-03-27
JPS6482800A	1989-03-28

IEIRI Takeshi (JP)

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