Title:
MANUFACTURING PROCESS FOR ULTRASONIC ATOMIZATION SHEET
Document Type and Number:
WIPO Patent Application WO/2021/004117
Kind Code:
A1
Abstract:
A manufacturing process for an ultrasonic atomization sheet, comprising: S1, cutting a pressure thermosetting conductive adhesive film (2) to be a shape matching a piezoelectric ceramic sheet (3); S2, placing the pressure thermosetting conductive adhesive film (2) on a composite plate (1), wherein the composite plate (1) comprises a substrate (11) and a conductive layer (12), the pressure thermosetting conductive adhesive film (2) is disposed on the conductive layer (12), and the substrate (11) is a polymer film; S3, placing the piezoelectric ceramic sheet (3) on the pressure thermosetting conductive adhesive film (2); and S4, using a press machine to laminate the piezoelectric ceramic sheet (3) and the composite plate (1) in S3.
Inventors:
ZHENG YAO (CN)
SU QIUHONG (CN)
SU SONGWAN (CN)
SU QIUHONG (CN)
SU SONGWAN (CN)
Application Number:
PCT/CN2020/085845
Publication Date:
January 14, 2021
Filing Date:
April 21, 2020
Export Citation:
Assignee:
SHENZHEN SHANG JIN ELECTRONIC SCIENCE AND TECH CO LTD (CN)
International Classes:
H05K3/32; B05B17/06; H05K3/00; H05K13/04
Foreign References:
| CN110324985A | 2019-10-11 | |||
| CN106493032A | 2017-03-15 | |||
| CN101422777A | 2009-05-06 | |||
| CN107412926A | 2017-12-01 | |||
| CN109261428A | 2019-01-25 | |||
| TW200940114A | 2009-10-01 |
Other References:
See also references of EP 3962245A4
Attorney, Agent or Firm:
BEIJING KEYI INTELLECTUAL PROPERTY FIRM (CN)
Download PDF: