Title:
MARK DETECTION METHOD, LIGHT EXPOSURE METHOD AND LIGHT EXPOSURE DEVICE, AND METHOD FOR MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/073483
Kind Code:
A1
Abstract:
An alignment mark (AM) provided on a wafer (W) using an alignment system is imaged while a wafer stage is actuated on the basis of a measurement result of a position measuring system, and the position of the alignment mark (AM) is sought from an imaging position (dx, dy) of the alignment mark (AM) that is sought from the imaging result, and the position of the wafer stage at the time of imaging that is sought from the measurement result of the position measuring system. During imaging of the alignment mark, the wafer stage is actuated at a constant velocity over a movement distance that is an integral multiple of a measuring period of the position measuring system, and the position of the wafer stage at the time of imaging is sought from the average of the measurement results of the position measuring system. Precise alignment measurement is made possible thereby without being affected by periodic error of the position measuring system.
Inventors:
KANAYA YUHO (JP)
Application Number:
PCT/JP2011/006646
Publication Date:
June 07, 2012
Filing Date:
November 29, 2011
Export Citation:
Assignee:
NIKON CORP (JP)
KANAYA YUHO (JP)
KANAYA YUHO (JP)
International Classes:
H01L21/027; G01B11/00; G03F9/00; H01L21/683
Domestic Patent References:
| WO2008029758A1 | 2008-03-13 |
Foreign References:
| JP2010074075A | 2010-04-02 | |||
| JP2009182063A | 2009-08-13 |
Attorney, Agent or Firm:
TATEISHI, Atsuji (JP)
Tokuji Tateishi (JP)
Tokuji Tateishi (JP)
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