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Patent Searching and Data


Title:
MASK AND FILM-FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/155452
Kind Code:
A1
Abstract:
This mask is used for supplying a resin material to a substrate via an opening provided in a mask body, and forming a liquid resin material film upon the substrate. In a side surface constituting the opening in the mask body, at least a site located in the vicinity of the substrate is constituted by a material having a greater contact angle for the liquid organic material than the material of the mask body.

Inventors:
SEI Kensuke (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
AODAI Makoto (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
TAKAHASHI Hirohisa (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
YAJIMA Takahiro (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
KATO Yuko (Inc. 2500, Hagisono, Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
Application Number:
JP2018/006064
Publication Date:
August 30, 2018
Filing Date:
February 20, 2018
Export Citation:
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Assignee:
ULVAC, INC. (2500, Hagisono Chigasaki-sh, Kanagawa 43, 〒2538543, JP)
International Classes:
B05B12/16; B05B7/24
Domestic Patent References:
WO2007123006A12007-11-01
Foreign References:
JP2010227734A2010-10-14
JPH06262106A1994-09-20
JP2016533408A2016-10-27
JP2008159741A2008-07-10
JP2011117030A2011-06-16
JP2000087224A2000-03-28
Other References:
NEDOX, 15 May 2018 (2018-05-15), Retrieved from the Internet
Attorney, Agent or Firm:
OIKAWA Shu et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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