Title:
MASK FRAME ASSEMBLY AND EVAPORATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/121196
Kind Code:
A1
Abstract:
Disclosed is a mask frame assembly (7), comprising: a hollow frame (10) provided with a hollow region (X); and a first support bar (30) provided across the hollow region (X) of the hollow frame (10) in a first direction (I). The mask frame assembly (7) supports a fine metal mask (20) comprising a mask pattern region (C) and unused mask regions (D, D') surrounding the mask pattern region. When the fine metal mask (20) is supported by the mask frame assembly (7), two opposite ends of the fine metal mask (20) are fixed on the hollow frame (10) in a second direction (J), the mask pattern region (C) of the fine metal mask (20) is disposed in the hollow region (X) of the hollow frame (10), and the projection of the first support bar (30) on the fine metal mask (20) is located in the unused mask regions (D, D'). Further disclosed is an evaporation device.
Inventors:
LIN ZHIMING (CN)
WANG ZHEN (CN)
ZHANG JIAN (CN)
WANG ZHEN (CN)
ZHANG JIAN (CN)
Application Number:
PCT/CN2017/114784
Publication Date:
July 05, 2018
Filing Date:
December 06, 2017
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
ORDOS YUANSHENG OPTOELECTRONICS CO LTD (CN)
ORDOS YUANSHENG OPTOELECTRONICS CO LTD (CN)
International Classes:
C23C14/04; C23C14/12; C23C14/24
Foreign References:
| CN106480404A | 2017-03-08 | |||
| CN206279261U | 2017-06-27 | |||
| CN106086782A | 2016-11-09 | |||
| KR20100000129A | 2010-01-06 | |||
| CN103695841A | 2014-04-02 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
Download PDF:
Previous Patent: PACKAGING CHIP AND SIGNAL TRANSMISSION METHOD BASED ON PACKAGING CHIP
Next Patent: LUMINAL STENT
Next Patent: LUMINAL STENT