MASK PRINTING METHOD AND DEVICE

WIPO Patent Application WO/2013/073426

A1

This method and device improve mask cleaning, and involve printing a printing agent in a state in which a mask is supported from below by a pair of mask support members, or, after printing, separating the mask and the circuit substrate in a state in which the mask is supported from below by the pair of mask support members. If the distance L between the substrate (206)-side end of the portion of a mask (412) that is supported by a mask suction support member (62) and the boundary between the mask (412) and a mask holding sheet (414) is greater than or equal to the sum of width F of the mask suction support member (62) and width W of a wiping unit (627), then the wiping unit (627) is moved from the supported portion of the mask (412) up to the end position on the side opposite of the substrate (206) to wipe away solder. If said distance L is smaller than the sum of width F and width W, then, after passing the portion of the mask (412) in contact with the substrate (206), the wiping unit (627) is separated from the mask (412) and the mask (412) is wiped up while the mask (412) is moved in a direction parallel with the mask (412) up to the aforementioned boundary.

KATO MITSUAKI (JP)
MATSUZAKI NAOKI (JP)

PCT/JP2012/078806

May 23, 2013

November 07, 2012

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FUJI MACHINE MFG (JP)
KATO MITSUAKI (JP)
MATSUZAKI NAOKI (JP)

B41F35/00; B41F15/08; B41F15/12; H05K3/34

JP2007245435A	2007-09-27
JP2007307750A	2007-11-29
JP2011161724A	2011-08-25

CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)

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