FIELD

[0001] Embodiments of the present disclosure relate to masks for substrates used during material deposition. In particular, embodiments of the present disclosure relate to substrate supports with masks employed during material deposition in a vacuum environment, particularly in a vacuum deposition chamber of substrate processing apparatus.

BACKGROUND

[0002] Several methods are known for the deposition of a material on a substrate. For example, a substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, etc., or a chemical vapor deposition (CVD) process. A substrate on which material is deposited, i.e. a substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and is positioned relative to a processing area of the vacuum chamber of the vacuum processing system. For example, a coating process can take place in the vacuum chamber.

[0003] Coating processes, i.e. material deposition processes, may be considered for large area substrates, e.g. in display manufacturing technology. Coated substrates can be used further in several technical fields with applications e.g. in microelectronics, in the production of semiconductor devices, for substrates with thin film transistors, but also for insulating panels, etc. The tendency towards larger substrates, e.g. in manufacturing larger displays results in larger vacuum processing systems.

[0004] In a coating process, substrates may be held on a substrate support. Further, conventionally the edges of the substrate support and the edges of the substrate are masked by a mask, particularly an edge exclusion mask, in order to avoid material deposition on the substrate support at the rear of the substrate and prevent deposition material escaping on to chamber walls of the deposition chamber in which the deposition process is carried out. The masks of the state of the art have the disadvantage that material deposition on the masks results in a shadow effect causing a shrinkage of the mask over time. The increasing mask shrinkage over time leads to a non-uniform coating thickness on the substrate, particularly on the substrate edges. Further, the usable area of the substrate is decreased. Accordingly, in order to reduce the above-mentioned negative effects, an increased number of maintenance and cleaning intervals have to be carried out resulting in increased processing downtimes. Further, it has been found that the shrinkage of the mask can cause scratching of the substrate upon removal of the mask.

[0005] In light of the above, it is beneficial to provide an improved masking, particularly to increase the processing efficiency of a substrate.

SUMMARY

[0006] In light of the above, a mask for masking a rear of an edge of a substrate, a substrate holder, a substrate processing apparatus, a method for layer deposition on a substrate, and a method of manufacturing one or more devices on a substrate according to the independent claims are provided. Further features, details, aspects, implementation and embodiments are shown in the dependent claims, the description and the drawings.

[0007] According to an aspect of the present disclosure, a mask for masking a rear of an edge of a substrate is provided. The mask includes a frame having an opening for receiving the substrate. The frame has a protrusion provided at an inner side of the frame. The protrusion extends towards the rear of the edge of the substrate.

[0008] According to another aspect of the present disclosure, a substrate holder is provided. The substrate holder includes a table body having a first level for supporting a substrate and second level for supporting a mask according to any embodiments described herein. The second level is below the first level. [0009] According to another aspect of the present disclosure, a substrate processing apparatus is provided. The substrate processing apparatus includes a vacuum deposition chamber, an arrangement of deposition sources, and a substrate holder according to any embodiments described herein.

[0010] According to another aspect of the present disclosure, a method for layer deposition on a substrate is provided. The method includes placing the substrate on a substrate holder, masking a rear of an edge of the substrate, particularly by employing a mask according to any embodiments described herein, and depositing material on the substrate.

[0011] According to another aspect of the present disclosure, a method of manufacturing one or more devices on a substrate is provided. The method includes using the method for layer deposition on the substrate according to any embodiments described herein.

[0012] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 A shows a schematic perspective view of a mask according to embodiments described herein; FIG. IB shows a schematic sectional view along line A-A shown in Fig. 1 of a mask according to embodiments described herein ;

FIGS. 2 and 3 shows a detailed portion of Fig. IB for explaining further features of the mask according to embodiments described herein;

FIG. 4 shows a schematic perspective view of a mask according to further embodiments described herein;

FIGS. 5 and 6 show schematic sectional views of a mask according to yet further embodiments described herein;

FIG. 7 shows a schematic perspective view of a mask according to further embodiments described herein;

FIG. 8 shows a portion of FIG. 7 with an enlarged section for explaining further features of the mask according to embodiments described herein;

FIG. 9 shows sectional view of a substrate holder according to embodiments described herein,

FIG. 10 shows a portion of FIG. 9 for explaining further features of the substrate holder according to embodiments described herein;

FIG. 11 shows a sectional view of a portion of a substrate holder according to further embodiments described herein,

FIG. 12 shows a schematic view of a substrate processing apparatus according to embodiments described herein; and

FIG. 13 shows a block diagram for illustrating a method for layer deposition on a substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0014] Reference will now be made in detail to the various embodiments, one or more examples of which are illustrated in each figure. Each example is provided by way of explanation and is not meant as a limitation. For example, features illustrated or described as part of one embodiment can be used on or in conjunction with any other embodiment to yield yet a further embodiment. It is intended that the present disclosure includes such modifications and variations. Within the following description of the drawings, the same reference numbers refer to the same or to similar components. Generally, only the differences with respect to the individual embodiments are described. Unless specified otherwise, the description of a part or aspect in one embodiment can apply to a corresponding part or aspect in another embodiment as well.

[0015] With exemplarily reference to FIGS. 1 A to 8, a mask 100 for masking a rear 10R of an edge 10E of a substrate 10 according to embodiments of the present disclosure is described.

[0016] According to embodiments, which can be combined with any other embodiments described herein, the mask 100 includes a frame 110 having an opening 111 for receiving the substrate 10, as exemplarily shown in FIG. 1A. The frame 110 has a protrusion 112 provided at an inner side 110A of the frame, as exemplarily shown in FIG. IB. The protrusion 112 extends towards the rear 10R of the edge 10E of the substrate 10. As can be seen from FIG. IB, typically there is no overlap of the mask 100 and the front 10F of the substrate 10.

[0017] Accordingly, compared to the state of the art, an improved mask is provided. In particular, embodiments of the mask as described herein beneficially provide for avoiding the shadow effect of conventional masks. Further, embodiments of the mask according to the present disclosure beneficially provide for a reduction of maintenance and cleaning intervals resulting in a decrease of processing downtimes. Accordingly, embodiments of the mask as described herein have a longer mask lifetime. Further, with the mask according to the present disclosure, coating uniformity of the substrate, particularly at the substrate edges, can be improved. In other words, by employing a mask as described herein, a uniform coating thickness can be provided on the entire front side of the substrate. Additionally, the risk of scratching the substrate upon removal of the mask can be eliminated. Yet further, due to the fact that there is no overlap of the mask as described herein and the front of the substrate, beneficially no orientation matching of the substrate and mask is needed, facilitating the mounting of the mask.

[0018] Before various further embodiments of the present disclosure are described in more detail, some aspects with respect to some terms used herein are explained.

[0019] In the present disclosure, a “mask for masking a rear of an edge of a substrate” can be understood as a mask configured to mask a rear of an edge of a substrate. In particular, the term “mask” can be understood as mask configured to hinder or avoid material deposition on the masked substrate.

[0020] The term “edge of a substrate” can be understood as an edge region of the substrate. For example, the edge of the substrate can be understood as the outermost 10% or less of the substrate.

[0021] In the present disclosure, a “rear of a substrate” can be understood as the side of the substrate which is to be supported by a substrate support. The term “front of a substrate” can be understood as the side of the substrate which is to be coated by material deposition.

[0022] In the present disclosure, the term “front” refers to the side supposed for material deposition. The term “rear” refers to the opposite side with respect to the front side.

[0023] In the present disclosure, a “substrate” may particularly embrace substantially inflexible substrates, e.g., glass plates or metal plates. The term “substantially inflexible” is understood to distinguish over “flexible”. Specifically, a substantially inflexible substrate can have a certain degree of flexibility, e.g. a glass plate having a thickness of 0.5 mm or below, wherein the flexibility of the substantially inflexible substrate is small in comparison to the flexible substrates. For example, the substrate can have a thickness of 0.1 mm to 1.8 mm. According to embodiments described herein, the substrate may be made of any material suitable for material deposition. For instance, the substrate may be made of a material selected from the group consisting of glass (for instance soda-lime glass, borosilicate glass etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other material or combination of materials which can be coated by a deposition process.

[0024] According to some embodiments, the substrate can be a “large area substrate” and may be used for display manufacturing. For instance, the substrate may be a glass or plastic substrate. For example, substrates as described herein shall embrace substrates which are typically used for an LCD (Liquid Crystal Display), a PDP (Plasma Display Panel), and the like. For instance, a “large area substrate” can have a main surface with an area of 0.5 m ² or larger, particularly of 1 m ² or larger. In some embodiments, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m ² substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m ² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m ² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m ² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m ² substrates (2.85 m * 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0025] In the present disclosure, a “frame” can be understood as a closed mechanical structure building a frame around an opening.

[0026] In the present disclosure, a “an opening for receiving a substrate” can be understood as an opening of the frame which is configured for receiving a substrate as described herein.

[0027] In the present disclosure, a “protrusion” can be understood as a protruding part or mechanical structure of the frame. Typically, the protrusion 112 extends towards the front side 11 OF of the frame 110, as exemplarily shown in FIG. IB. Further, as exemplarily shown in FIG. IB, typically a front surface 114 of the protrusion 112 is directed towards a plane 11 IP defined by the opening 111 of the frame 110. Accordingly, with exemplary reference to FIG. IB, typically the front surface 114 of the protrusion 112 is below the plane 11 IP defined by the opening 111.

[0028] In the present disclosure, an “inner side of the frame” can be understood as a side of the frame facing or directed towards the opening of the frame. An “outer side of the frame” can be understood as a side of the frame facing or directed towards a lateral outside of the frame. Accordingly, it is to be understood that the inner side of the frame is directed in an opposite direction with respect to the outer side of the frame.

[0029] In the present disclosure, the term “inner” refers to the direction towards an inner side of the frame and the term “outer” refers to a direction towards a lateral outside of the frame.

[0030] With exemplary reference to FIG. 2, according to embodiments, which can be combined with any other embodiments described herein, the protrusion 112 has an undercut 113 with respect to a front surface 114 of the protrusion 112 for masking the rear of the edge of the substrate 10. Typically, the front surface 114 of the protrusion 112 for masking the rear of the edge of the substrate 10 is substantially parallel to the surface of the rear 10R of the substrate 10. The term “substantially parallel” may be understood as parallel within a tolerance t of t < ± 15°, particularly t < ± 10°, more particularly t < ± 5°, for example t < ± 1°.

[0031] According to embodiments, which can be combined with any other embodiments described herein, the protrusion 112 has a first side surface 115 facing towards an outer side of the frame 110, as shown in FIG. 2. Typically, the first side surface 115 has an undercut angle a of a< 90° with respect to the rear surface 10R of the substrate 10. The undercut angle a can be selected from a range of ai < a< 012. The lower limit ai can be ai = 20°, particularly ai = 30°, more particularly ai = 40°. The upper limit a? can be a? = 89°, particularly 012 = 87°, more particularly a.2 = 85°. For example, the undercut angle a can be 75° ± 5°. It is to be noted that since the front surface 114 of the protrusion 112 is typically substantially parallel to the surface of the rear 10R of the substrate 10, the undercut angle aof the first side surface 115 with respect to the front surface 114 of the protrusion 112 may correspond to the undercut angle a of the first side surface 115 with respect to the surface of the rear 10R of the substrate 10.

[0032] According to embodiments, which can be combined with any other embodiments described herein, the protrusion 112 has a second side surface 116 facing towards an inner side 110A of the frame 110. Typically, the second side surface 116 is substantially perpendicular to the surface of the rear 10R of the substrate 10. Additionally, or alternatively, the second side surface 116 can be substantially perpendicular to the front surface 114 of the protrusion 112. The term “substantially perpendicular” may be understood as perpendicular within a tolerance t of t < ± 15°, particularly t < ± 10°, more particularly t < ± 5°, for example t < ± 1°.

[0033] With exemplary reference to FIG. 3, according to embodiments, which can be combined with any other embodiments described herein, the frame 110 has an inclined section 117 provided between the protrusion 112 and an outer side HOB of the frame 110. Typically, the inclined section 117 faces towards the front side 11 OF of the frame 110. The inclined section 117 may have an inclination angle P of P > 90° with respect to a surface of the front 10F of the substrate 10. Since the surface of the front 10F of the substrate 10 is typically parallel to the surface of the rear 10R of the substrate and the surface of the rear 10R of the substrate is typically parallel to the front surface 114 of the protrusion 112, the inclination angle P of the inclined section 117 with respect to the surface of the front 10F of the substrate 10 may correspond to the inclination angle P of the inclined section 117 with respect to the front surface 114 of the protrusion 112.

[0034] The inclination angle P can be selected from a range of P i < P < P 2. The lower limit Pi can be Pi = 95°, particularly Pi = 105°, more particularly Pi = 115°. The upper limit P 2 can be P 2 = 175°, particularly P2 = 170°, more particularly P2 = 165°. For example, the inclination angle P can be P = 120°± 5°. It is to be noted that since the front surface 114 of the protrusion 112 is typically substantially parallel to the surface of the rear 10R of the substrate 10, the undercut angle a of the first side surface 115 with respect to the front surface 114 of the protrusion 112 may correspond to the undercut angle a of the first side surface 115 with respect to the surface of the rear 1 OR of the substrate 10.

[0035] With exemplary reference to FIG. 3, according to embodiments, which can be combined with any other embodiments described herein, the frame 110 may have one or more intermediate sections 118 provided between the inclined section 117 and the protrusion 112, particularly the first side surface 115 of the protrusion 112. Typically, the one or more intermediate sections 118 have a different surface orientation than the inclined section 117. Further, in the case of two or more intermediate sections 118, the intermediate sections 118 may have different surface orientations with respect to each other, as exemplarily shown in FIG. 5. It is to be understood that typically the inclined section 117 and the first side surface 115 of the protrusion, optionally together with the one or more intermediate sections 118, provide for a cavity 119 in the front side 11 OF of the frame 110. Typically, the cavity 119 is located at an inner edge region of the frame 110.

[0036] According to embodiments, which can be combined with any other embodiments described herein, the frame 110 includes four or more frame elements 120 building the frame, as exemplarily shown in FIG. 4. For instance, the frame 110 may include a first frame element 120A, a second frame element 120B, a third frame element 120C and a fourth frame element 120D. The first frame element 120 A and the second frame element 120B may provide two opposing sides of the frame 110. The third frame element 120C and the fourth frame element 120D may provide two other opposing sides of the frame 110. Accordingly, the frame can have rectangular or square shape. Typically, the first frame element 120A is identical with the second frame element 120B. Further, the third frame element 120C can be identical with the fourth frame element 120D. Accordingly, the frame may be comprised of only two different types of frame elements.

[0037] According to embodiments, which can be combined with any other embodiments described herein, at least one of the four or more frame elements 120 is a single piece element. Accordingly, the first frame element 120A and/or the second frame element 120B and/or the third frame element 120C and/or the fourth frame element 120D can be a single piece element, particularly an integral single piece element. Typically, all of the four or more frame elements 120 are single piece elements, particularly integral single piece elements.

[0038] With exemplarily reference to FIG. 5, according to embodiments, which can be combined with any other embodiments described herein, the frame 110 includes one or more cooling lines 131. Typically, the one or more cooling lines 131 are provided inside the frame. The one or more cooling lines 131 can be configured for providing coolant to cool the frame 110.

[0039] According to embodiments, which can be combined with any other embodiments described herein, the one or more cooling lines 131 are integrated in the frame 110. According to an example, which can be combined with other embodiments described herein, the one or more cooling lines 131 can be provided in a separate cooling frame 130, as exemplarily shown in FIG. 6.

[0040] According to embodiments, which can be combined with any other embodiments described herein, the frame 110 includes one or more receptions 135 for receiving one or more fixation elements 215 for fixing and/or positioning the frame 110 with respect to a main body 210 of a substrate holder 200 as exemplarily described with reference to FIGS 10 and 11. Typically, the one or more receptions 135 are provided on a rear side 11 OR of the frame 110.

[0041] With exemplary reference to FIG. 6, according to embodiments, which can be combined with any other embodiments described herein, the frame 110 includes a separate front shield frame 140 providing the front surface of the frame 110. The front shield frame 140 can include a top shield 141 and a bottom shield 142. Typically, the top shield 141 includes the inclined section 117 as described herein. As exemplarily shown in FIG. 6, the top shield 141 can be in contact with the cooling frame 130. In other words, the top shield 141 may rest on the cooling frame 130. It is to be understood, that, during processing, the top shield 141 absorbs the heat load. The bottom shield 142 typically includes the protrusion 112 as described herein. Further, as exemplarily shown in FIG. 6, the bottom shield 142 may include one or more receptions 135 for receiving one or more fixation elements 215 for fixing and/or positioning the frame 110 with respect to a main body 210 of a substrate holder 200 as exemplarily described with reference to FIGS 10 and 11.

[0042] It is to be understood that providing a frame with a separate front shield frame, for example having a top shield and a bottom shield as describe herein, and a separate cooling frame has the advantage that for cleaning of the frame the top shield can be removed separately while the cooling frame may remain.

[0043] According to embodiments, which can be combined with any other embodiments described herein, a labyrinth path 143 is provided in an overlapping region 144 between the top shield 141 and the bottom shield 142, as exemplarily shown in FIG. 6. The labyrinth path 143 can be beneficial for preventing escape of deposition material to chamber walls of the deposition chamber in which the deposition process is carried out.

[0044] With exemplary reference to FIG. 7, according to embodiments, which can be combined with any other embodiments described herein, the front shield frame 140 is built by a plurality of front shield frame elements 145. FIG. 8 shows a portion of FIG. 7 with an enlarged section for explaining further features of the mask according to embodiments described herein. In particular, the front shield frame elements 145 can be configured and arranged such that neighboring front shield frame elements 145 have an overlap 147, as exemplarily shown in FIG. 8. Typically, the end portions of the front shield frame elements 145 are configured for providing an interlock at the overlap 147. Further, as exemplarily shown in FIG. 8, a gap 146 between neighboring front shield frame elements 145 can be provided. The gap between neighboring front shield frame elements can be beneficial for allowing thermal expansion of the front shield frame elements without inducing mechanical stress in the frame.

[0045] With exemplary reference to FIGS. 9 to 11, a substrate holder 200 according to embodiments of the present disclosure is described. According to embodiments, which can be combined with any other embodiments described herein, the substrate holder 200 includes a main body 210 having a first level 211 for supporting a substrate 10 and second level 212 for supporting a mask 100 according to any embodiments described herein. As exemplarily shown in FIG. 9, the second level 212 is below the first level 211. In other words, the first level 211 can be a substrate support level and the second level 212 can be a mask support level. Typically, the first level 211 is elevated with respect to the second level 212. It is to be noted that the first level 211 can be provided by a simple plate, an electrostatic chuck, or a gecko chuck to hold the substrate.

[0046] With exemplary reference to FIG. 10, according to embodiments, which can be combined with any other embodiments described herein, the mask 100 is releasably fixable to the main body 210 via one or more fixation elements 215 connecting the mask 100 with the main body 210. The fixation elements 215 can be configured for fixing and/or positioning the mask 100, particularly the frame 110, with respect to the main body 210. For instance, the one or more fixation elements 215 can be clamping elements and/or positioning elements, e.g. positioning pins. Typically, the one or more fixation elements 215 engage with one or more receptions 135 as described herein. Further, typically, the fixation elements and the receptions are configured to allow for thermal expansion without inducing mechanical stress at elevated temperatures in the frame when the fixation elements engage with the receptions.

[0047] With exemplary reference to FIG. 11, according to embodiments, which can be combined with any other embodiments described herein, the bottom shield 142 is fixed and/or positioned via one or more fixation elements 215 with respect to the main body 210 of the substrate holder 200. Further, as exemplarily shown in FIG. 11, the main body 210 may have a third level 213 for supporting the cooling frame 130. Typically, the third level 213 is provided between the first level 211 and the second level 212. According to embodiments, which can be combined with other embodiments described herein, the cooling frame 130 may be supported separately from the main body 210. For example, for substrate exchange, the top shield 141 and the cooling frame 130 can remain stationary, whereas the main body 210 and the bottom shield 142 may be lowered.

[0048] According to embodiments, which can be combined with embodiments described herein, the substrate support holder is configured to be operated inside a vacuum chamber, particularly a vacuum chamber of a substrate processing apparatus as. The vacuum can be a constant vacuum, or the vacuum can be cycled, i.e. vary between a vacuum state and a pressurized state.

[0049] According to some embodiments of the present disclosure, which can be combined with other embodiments described herein, the substrate holder can be a support table, e.g. a substrate support table, or a pedestal, e.g. a substrate support pedestal provided in a processing chamber of a vacuum processing system. The support table may particularly be configured for horizontal substrate processing or essentially horizontal substrate processing. For example, the processing chamber including the substrate support may be provided in a cluster system. When loading the substrate onto the substrate support, the substrate may be provided onto an electrostatic chuck until electrostatic forces are established. Some embodiments of the present disclosure provide a substrate support with an electrostatic chuck.

[0050] With exemplary reference to FIG. 12, a substrate processing apparatus 300 according to the present disclosure is described. According to embodiments, which can be combined with embodiments described herein, the substrate processing apparatus 300 includes a vacuum deposition chamber 310, an arrangement of deposition sources 320, and a substrate holder 200 with a mask 100 according to any embodiments described herein. In particular, the arrangement of deposition sources 320 and the substrate holder 200 with the mask 100 are arranged within the vacuum deposition chamber 310.

[0051] In the present disclosure, the term “vacuum” can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10' ⁵ mbar and about 10' ⁸ mbar, more typically between 10' ⁵ mbar and 10" ⁷ mbar, and even more typically between about 1 O' ⁶ mbar and about 10" ⁷ mbar.

[0052] In the present disclosure, an “arrangement of deposition sources” can be understood as an arrangement of a plurality of deposition sources. The individual deposition sources of the arrangement of deposition sources may be of identical or different configuration.

[0053] In the present disclosure, a “deposition source” can be understood as a source configured for material deposition, particularly by employing a sputter deposition process, particularly a magnetron sputtering process. Typically, the deposition source is a vertical deposition source, i.e. having a longitudinal main axis extending in a substantially vertical direction.

[0054] According to some embodiments described herein, which can be combined with other embodiments described herein, the deposition material of the deposition sources can be chosen according to the deposition process and the later application of the coated substrate. For instance, the deposition material can be a material selected from the group consisting of Metals, such as aluminum, molybdenum, titanium, copper, or the like, silicon, indium tin oxide, other transparent conductive oxides, and semi-conductive materials. Oxide-, nitride- or carbide-layers, which can include such materials, can be deposited by providing the material from the material deposition source or by reactive deposition, i.e. the material from the material deposition source can react with elements like oxygen, nitride, or carbon from a processing gas. Further, it is to be understood that the substrate processing apparatus may be adapted for processing and coating semiconductor wafers.

[0055] Embodiments described herein can relate to components of a deposition system in which substrates, which can be substrates as described above, are loaded and unloaded in a horizontal configuration and in which the substrates are processed, e.g. coated, in a vertical configuration. A deposition system according to some embodiments described herein are suitable for use in a deposition apparatus in which a substrate is supported in different configurations, particularly in a processing apparatus including a tilt drive for moving the substrate between a horizontal and a vertical configuration. Further, the substrate processing apparatus as described herein can be provided in a cluster system, in which one or more substrate processing apparatuses are coupled to a central transfer chamber, particularly a central vacuum transfer chamber.

[0056] Referring to FIG. 13, a block diagram illustrating a method 400 for layer deposition on a substrate according to embodiments of the present disclosure is shown. The substrate may particularly be a large area substrate as described herein and/or a substrate for display manufacturing. The method includes in box 410 placing the substrate on a substrate holder, particularly a substrate holder 200 as described herein. Additionally, the method includes in box 420 masking a rear of an edge of the substrate, particularly by employing a mask 100 according to any embodiments described herein. Further, the method includes in box 430 depositing material on the substrate, particularly by using a substrate processing apparatus 300 as described herein.

[0057] Accordingly, it is to be understood that a method of manufacturing one or more devices on a substrate, comprising using the method for layer deposition as described herein, can be provided. For example, the one or more devices can be optoelectronical devices, e.g. displays. [0058] In view of the embodiments described herein, it is to be understood that, compared to the state of the art, an improved mask, an improved substrate holder, an improved substrate processing apparatus, an improved method for layer deposition on a substrate, and an improved method of manufacturing one or more devices on a substrate are provided. In particular, embodiments as described herein beneficially provide for avoiding the shadow effect of conventional masks. Additionally, embodiments according to the present disclosure beneficially provide for a reduction of maintenance and cleaning intervals resulting in a decrease of processing downtimes. Further, embodiments as described herein provide for improved coating uniformity.

[0059] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.