BACKGROUND ART Fig. 14 is a cross-sectional view illustrating a prior art mat switch as taught in published Japanese Patent Application Laid-Open No. (HEI) 9-326216. As illustrated in Fig. 14, the mat switch has eight layers laminated together. A cover sheet 500 is disposed on the top of the mat switch. A shock-absorbing sheet 510 is located beneath the cover sheet 500.

An upper electrode sheet 520 is disposed beneath the shock-absorbing sheet 510. An insulative spacer 530 defined with many apertures 531 are provided beneath the upper electrode sheet 520. A lower electrode sheet 540 is positioned beneath the spacer 530. A backboard 561 is provided below the lower electrode sheet 540. Vinyl sheets 550,570 form a pocket 560 below the lower electrode sheet 540. The backboard 561 is inserted in the pocket 560.

When an individual plantarly treads on the mat switch, then the upper and lower electrode sheets 520,540 are forced into contact with one another through the apertures 531, thereby turning on the mat switch.

The backboard 561 is used to avoid folding a switch region, i. e., a region that forms the upper electrode sheet 520. Therefore, the backboard 561 has strength enough to resist folding up the switch region when the backboard 561 experiences ordinary forces. The backboard 561, made from foam polyethylene, is high in hardness and is 1.5 mm in thickness. The backboard 561 is made heavy in weight to prevent the mat switch from being slid out of position or displaced. As a result, the mat switch can stably be laid down.

In the prior art mat switch, the vinyl sheet 550 is high-frequency welded onto the vinyl sheet 570 to form the pocket 560. As a result, welded spots 571 are objectionably made smaller in thickness, and are consequently poorer in strength than the other portions of the vinyl sheet 570. In addition, the vinyl sheet 570 serves as a reverse sheet to cover the reverse side of the mat switch, and the welded spots 571 are objectionably held in direct contact with the floor surface on which the mat switch rests. As a result, when the mat switch has been in long-time use, then an individual's stomp

produces the likelihood of the vinyl sheet 570 being damaged, which occurs from the neighborhood of the welded spots 571. The heavy-weighted backboard 561 designed to preclude the slippage and/or displacement of the mat switch as discussed above imposes heavier loads on the welded spots 571. As a result, there is an increased likelihood that the vinyl sheet 570 might be damaged, when compared with backboards not designed as above.

DISCLOSURE OF INVENTION In view of the above, an object of the present invention is to provide a mat switch durable in long-time service, and an art related thereto.

A first aspect of the present invention provides a mat switch comprising a first sheet, a pad layer, a switch layer including a sheet-like switch operable to detect stomps on the mat switch, and a second sheet.

The pad layer and the switch layer are laminated together in between the first and second sheets. The pad layer includes a third sheet, a pad, and a fourth sheet. The pad is disposed at a position corresponding with a position where the sheet-like switch is located. The fourth sheet is attached to the third sheet so as to cover the pad.

Pursuant to the first aspect of the present invention, the pad layer is disposed between the first and second sheets, and consequently the third sheet having the fourth sheet placed thereon for covering the pad is held out of direct contact with the floor. This feature avoids damaging the mat switch to the utmost extent, which otherwise might occur as a result of the fourth sheet being secured to the third sheet.

In the mat switch according to the first aspect of the present invention, at least one of the third and fourth sheets is gas-permeable.

As a result, when the mat switch is treaded on, then air is blown out of the space enclosed by the third and fourth sheets (i. e. , the space in which the pad is present). That is, the air is ejected from the aforesaid space to the outside through the gas-permeable third and/or fourth sheet.

Consequently, a rise in pressure in the space enclosed the third and fourth sheets is suppressed, which otherwise would result from stomps on the mat switch. This feature avoids damaging the third and/or fourth sheet to the utmost extend, which otherwise might result from elevated internal pressures of the above space.

In the mat switch according to the first aspect of the present invention, the fourth sheet is attached to the third sheet in such a manner as to stream air through between the space enclosed by the third and fourth sheets and the external space around the former space, and to cover the pad.

As a result, when the mat switch is treaded on, then air is blown <BR> <BR> out of the space enclosed by the third and fourth sheets (i. e. , the space in which the pad is present). Consequently, a rise in pressure in the space enclosed the third and fourth sheets is suppressed, which otherwise would result from the stomps on the mat switch. This feature avoids damaging the third and/or fourth sheet to the utmost extend, which otherwise might result from elevated internal pressures of the above space.

In the mat switch according to the first aspect of the present invention, the pad layer is laminated upwardly on the first sheet. The switch layer is laminated upwardly on the pad layer. The second sheet is laminated upwardly on the switch layer. The first sheet contacts the floor during the use of the mat switch.

According to the above structure, the pad layer is laminated upwardly on the first sheet that contacts the floor. Consequently, the third sheet having the fourth sheet secured thereto for covering the pad remains out of direct contact with the floor. This feature avoids damaging the mat switch to the utmost extend, which otherwise might occur as a result of the fourth sheet being attached to the third sheet.

In the mat switch according to the first aspect of the present invention, the pad layer is laminated upwardly on the first sheet. The switch layer is laminated upwardly on the pad layer. A shock-absorbing sheet is laminated upwardly on the switch layer. The second sheet is laminated upwardly on the shock-absorbing sheet. The first sheet contacts the floor during the use of the mat switch.

According to the above structure, the pad layer is laminated upwardly on the first sheet that contacts the floor. Consequently, the third sheet having the fourth sheet secured thereto for covering the pad is held out of direct contact with the floor. This feature avoids damaging the mat switch to the utmost extend, which otherwise might occur as a result of the fourth sheet being attached to the third sheet. Since the shock-absorbing sheet is disposed below the second sheet that directly contacts the bottoms of the player's feet, stomp-caused shocks are alleviated. This construction avoids possible damage of the switch layer to the utmost extent.

In the mat switch according to the first aspect of the present invention, the switch layer is laminated upwardly on the first sheet. The pad layer is laminated upwardly on the switch layer. The second sheet is laminated upwardly on the pad layer. The first sheet contacts the floor during the use of the mat switch.

According to the above structure, the pad layer is laminated upwardly on the switch layer, and consequently the third sheet having the fourth

sheet attached thereto for covering the pad is held out of direct contact with the floor. This feature avoids damaging the mat switch to the utmost extend, which otherwise might result from the attachment of the fourth sheet to the third sheet.

In the mat switch according to the first aspect of the present invention, the shock-absorbing sheet is laminated upwardly on the first sheet. The switch layer is laminated upwardly on the shock-absorbing sheet.

The pad layer is laminated upwardly on the switch layer. The second sheet is laminated upwardly on the pad layer. The first sheet contacts the floor during the use of the mat switch.

According to the above structure, the pad layer is laminated upwardly on the switch layer, and consequently the third sheet having the fourth sheet fitted thereto for covering the pad remains out of direct contact with the floor. This feature avoids damaging the mat switch to the utmost extend, which otherwise might result from the attachment of the fourth sheet to the third sheet. In addition, the shock-absorbing sheet is laminated on the first sheet that directly contacts the floor. This construction prevents possible damage of the switch layer to the utmost degree, which otherwise might result from a stomp-caused thrust against the floor.

In the mat switch according to the first aspect of the present invention, the switch layer comprises a first electrode sheet formed with an electrically conductive region, an insulative spacer, and a second electrode sheet formed with an electrically conductive region. The first electrode sheet, the spacer, and the second electrode sheet are laminated together in such a manner that the electrically conductive region on the first electrode sheet and that on the second electrode sheet sandwich the spacer in a state in which the electrically conductive region on the first electrode sheet confronts that on the second electrode sheet. The electrically conductive region on the first electrode sheet is formed by the formation of a lattice-shaped electrical conductor on the surface of the first electrode sheet. The electrically conductive region on the second electrode sheet is formed by the formation of a lattice-shaped electrical conductor on the surface of the second electrode sheet. The lattice-shaped electrical conductors on the first and second electrode sheets are formed in a direction in which the lattice-shaped electrical conductor on the first electrode sheet intersects that on the second electrode sheet.

Pursuant to the above structure, the lattice-shaped electrical conductor on the first electrode sheet and that on the second electrode sheet are formed in the direction in which they intersect each other.

Consequently, the electrical conductor on the first electrode sheet and

that on the second electrode sheet readily contact one another, when compared with the case in which they are formed in the same direction. As a result, high-sensitive detection of the stomps is achievable.

In the mat switch according to the first aspect of the present invention, the lattice-shaped electrical conductor formed on the surface of the first electrode sheet is carbon. The electrically conductive region on the first electrode sheet includes linear silver so as to permit the liner silver to intersect the lattice-shaped carbon. The lattice-shaped electrical conductor formed on the surface of the second electrode sheet is carbon. The electrically conductive region on the second electrode sheet includes linear silver so as to permit the liner silver to intersect the lattice-shaped carbon.

Pursuant to the above structure, the electrically conductive region is formed partially by silver that is greater in conductivity than carbon.

As a result, higher sensitive detection of stomps on the mat switch is achievable, when compared with an electrically conductive region formed only by carbon. The electrically conductive region is formed predominantly by carbon that is lower in cost than silver, and the high-cost silver is consumed in amount adjustable in view of cost.

In the mat switch according to the first aspect of the present invention, apluralityofthe sheet-likeswitches is coextensivelyprovided.

Pursuant to the above structure, several individuals may share the single mat switch.

In this instance, the individuals may concurrently tread on the sheet-like switches. Alternatively, a single person may stomp on the sheet-like switches by moving the legs either concurrently or alternately.

As a further alternative, each of the sheet-like switches may be provided with a different function. As a result, the mat switch is available in wider applications.

A second aspect of the present invention provides an information-processing system comprising a mat switch and an information-processing apparatus operable to execute information processing in accordance with ON-OFF information from the mat switch. The mat switch comprises a first sheet, a pad layer, a switch layer including a sheet-like switch operable to detect stomps on the mat switch, and a second sheet. The pad layer and the switch layer are laminated together in between the first and second sheets. The pad layer includes a third sheet, a pad, and a fourth sheet. The pad is disposed at a position corresponding with a position where the sheet-like switch is located. The fourth sheet is secured to the third sheet so as to cover the pad.

Pursuant to the second aspect of the present invention, the pad layer is laminated between the first and second sheets, and consequently the third sheet having the fourth sheet attached thereto for covering the pad is held out of direct contact with the floor. This feature prevents possible damage of the mat switch (part of the information-processing system) to the utmost extent, which otherwise might occur as a result of the fourth sheet being secured to the third sheet.

BRIEF DESCRIPTION OF DRAWINGS The aforementioned and other features and objects of the present invention and the manner of attaining them will become more apparent and the invention itself will be best understood by reference to the following description of a preferred embodiment taken in conjunction with the accompanying drawings, wherein: Fig. 1 is an illustration showing the entire construction of a game system according to the present embodiments of the present invention; Fig. 2 is a breakaway, perspective view illustrating a mat switch of Fig. 1; Fig. 3 (a) is a plan view illustrating an upper electrode sheet of Fig. 2; Fig. 3 (b) is a plan view illustrating a spacer of Fig. 2 ; Fig. 3 (c) is a plan view illustrating a lower electrode sheet of Fig.

2; Fig. 4 is an enlarged view illustrating electrically conductive regions formed on the lower electrode sheet of Fig. 3 (c); Fig. 5 is a descriptive illustration showing a pad layer of Fig. 2 ; Fig. 6 is a cross-sectional view illustrating the mat switch along <BR> <BR> line N'A"'-"'A" ;<BR> Fig. 7 is a cross-sectional view illustrating the mat switch along<BR> line"B"-"B";<BR> Fig. 8 is an illustration showing the reverse side of the mat switch of Fig. 1 ; Fig. 9 is an illustration showing an electrical structure of an information-processing apparatus of Fig. 1 ; Fig. 10 is a block diagram illustrating a high-speed processor of Fig. 9; Fig. 11 is an illustration showing an exemplary modification of the mat switch of Fig. 1 ; Fig. 12 (a) is an illustration showing the surface of an exemplary modification of the pad layer of Fig. 5;

Fig. 12 (b) is an illustration showing the reverse side of the modified pad layer; Fig. 13 (a) is an illustration showing the surface of a further exemplary modification of the pad layer of Fig. 5; Fig. 13 (b) is an illustration showing the reverse side of the further modified pad layer ; and Fig. 14 is a descriptive illustration showing a prior art mat switch.

Best Mode for Carrying Out the Invention Embodiments of the present invention are now described with reference to the accompanying drawings. The same or corresponding components in the drawings are identified by the same reference characters, and descriptions related thereto are omitted. The following discusses a game system as an exemplary information-processing system.

Fig. 1 is an illustration showing the entire structure of the game system according to the present embodiments. As illustrated in Fig. 1, the game system includes a TV monitor 1, an information-processing apparatus 20, and a mat switch 40. An AV-cable 3 interconnects the TV monitor 1 and the information-processing apparatus 20. An AC-adaptor 5 supplies the information-processing apparatus 20 with DC-power voltage. Alternatively, the AC-adapter 5 may be replaced by a battery (not shown) to supply the DC-power voltage to the information-processing apparatus 20.

A power switch 24 is provided on the top of a housing of the information-processing apparatus 20. The mat switch 40 houses six numbers of sheet-like switches, which are discussed later. Turning on the power switch 24 allows ON-OFF information from the sheet-like switches to be sent to the information-processing apparatus 20 in response to a tread on the mat switch 40. The information-processing apparatus 20 practices information processing in accordance with the received ON-OFF information.

The mat switch 40 has six stomp regions 46,48, 52,54, 50,56 formed on an obverse sheet 42. The obverse sheet 42 forms the topmost layer of the mat switch 40. The six stomp regions 46,48, 52,54, 50,56 correspond with the hidden six sheet-like switches. Accordingly, a game player can stomp on each of the stomp regions 46,48, 52,54, 50,56 in order to switch on a corresponding one of the sheet-like switches. The stomp regions 46, 48,52, 54,50, 56 can be, e. g. , screen-printed onto the obverse sheet 42 in order to form them on the obverse sheet 42.

Fig. 2 is a breakaway, perspective view illustrating a structure of the mat switch 40 of Fig. 1. As seen from Fig. 2, the mat switch 40 includes a reverse sheet 190, a fabric sheet 180, pads 160,162, 164,166, 168,170,

fabric sheets 140,142, 144,146, 148,150, a lower electrode sheet 110, an insulative spacer 100, an upper electrode sheet 70, a shock-absorbing sheet 60, and the obverse sheet 42.

The mat switch 40 has the reverse sheet 190 disposed at the bottommost layer thereof, the fabric sheet 180 upwardly positioned on the reverse sheet 190, the pads 160 to 170 upwardly provided on the fabric sheet 180, the fabric sheets 140 to 150 upwardly disposed on the pads 160 to 170, the lower electrode sheet 110 upwardly located on the fabric sheets 140 to 150, the spacer 100 upwardly positioned on the lower electrode sheet 110, the upper electrode sheet 70 upwardly disposed on the spacer 100, the shock-absorbing sheet 60 upwardly located on the upper electrode sheet 70, and the obverse <BR> sheet 42 provided on the top of the shock-absorbing sheet 60, i. e. , at the topmost layer of the mat switch 40.

The lower electrode sheet 110 is formed with electrically conductive regions 112,114, 116, 118, 120,122, 124,126, 128,130, 132,134, and 136. The spacer 100 has a plurality of apertures 102 defined at regions corresponding with respective positions of the electrically conductive regions 112, 114,116, 118,120, and 122. The upper electrode sheet 70 is formed with electrically conductive regions 72,74, 76,78, 80, and 82 that correspond with the electrically conductive regions 112,114, 116,118, 120, and 122 on the lower electrode sheet 110, respectively. The upper electrode sheet 700 is formed with further electrically conductive regions 84,86, 88,90, 92, and 94. The lower electrode sheet 110, the spacer 100, and the upper electrode sheet 70 are laminated together in such a manner that the spacer 100 is sandwiched between the upper and lower electrode sheets 70,110 in a state in which the electrically conductive regions 112, 114,116, 118, 120, and 122 on the lower electrode sheet 110 squarely face the electrically conductive regions 72,74, 76,78, 80, and 82 on the upper electrode sheet 70, respectively. Accordingly, the electrically conductive regions 112 to 136 are formed on the upper surface of the lower electrode sheet 110, while the electrically conductive regions 72 to 94 are formed on the lower surface of the upper electrode sheet 70. In Fig. 2, the electrically conductive regions 72 to 94 are illustrated by dashed lines because they are formed on the lower surface of the upper electrode sheet 70.

The lower electrode sheet 110, the spacer 100, and the upper electrode sheet 70 form a switch layer 300. The electrically conductive region 112 on the lower electrode sheet 110, the electrically conductive region 72 on the upper electrode sheet 70, and a corresponding region of the spacer 100 form one of the sheet-like switches. The corresponding region of the

spacer 100 includes the apertures 102. The electrically conductive region 114 on the lower electrode sheet 110, the electrically conductive region 74 on the upper electrode sheet 70, and a corresponding region of the spacer 100 form another of the sheet-like switches. The corresponding region of the spacer 100 includes the apertures 102. The electrically conductive region 116 on the lower electrode sheet 110, the electrically conductive region 76 on the upper electrode sheet 70, and a corresponding region of the spacer 100 form yet another of the sheet-like switches. The corresponding region of the spacer 100 includes the apertures 102. The electrically conductive region 118 on the lower electrode sheet 110, the electrically conductive region 78 on the upper electrode sheet 70, and a corresponding region of the spacer 100 form a still further one of the sheet-like switches.

The corresponding region of the spacer 100 includes the apertures 102. The electrically conductive region 120 on the lower electrode sheet 110, the electrically conductive region 80 on the upper electrode sheet 70, and a corresponding region of the spacer 100 form a yet further one of the sheet-like switches. The corresponding region of the spacer 100 includes the apertures 102. The electrically conductive region 122 on the lower electrode sheet 110, the electrically conductive region 82 on the upper electrode sheet 70, and a corresponding region of the spacer 100 form the last sheet-like switch. The corresponding region of the spacer 100 includes the apertures 102. The sheet-like switches as just discussed above can be, e. g. , membrane switches.

The obverse sheet 42 as well as the reverse sheet 190 is made from, <BR> <BR> e. g. , polyvinyl chloride of a non-phthalic acid series. The shock-absorbing<BR> sheet 60 as well as the spacer 100 can be, e. g. , a spongy sheet of some<BR> 4 mm in thickness. The electrode sheets 70,110 can be, e. g. , transparent sheets fabricated from polypropylene. The fabric sheets 140 to 150 and 180 <BR> <BR> can be, e. g. , thin sheets made of fabrics. The pads 160 to 170 are made<BR> from, e. g. , polyurethane, each of which is some 8 mm in thickness.

Fig. 3 (a) is a plan view illustrating the upper electrode sheet 70 of Fig. 2. Fig. 3 (b) is a plan view illustrating the spacer of Fig. 2. Fig.

3 (c) is a plan view illustrating the lower electrode sheet 110 of Fig. 2.

As illustrated in Fig. 3 (a), the electrically conductive regions 72 to 82 are formed by the formation of lattice-shaped electrical conductor patterns on the underside of the upper electrode sheet 70. The electrically conductive regions 84,86, 88,90, 94, and 92 extend from the electrically conductive regions 72,74, 76,78, 80, and 82, respectively, toward the center of an edge of the upper electrode sheet 70 in the upper direction of Fig. 3 (a). The electrically conductive regions 84 to 94 are formed by

the formation of lattice-shaped electrical conductor patterns (not shown) on the underside of the upper electrode sheet 70.

As illustrated in Fig. 3 (c), the electrically conductive regions 112 to 122 are formed by the formation of lattice-shaped electrical conductor patterns on the upper surface of the lower electrode sheet 110. The electrically conductive region 126 interconnects the electrically conductive regions 112,114. The electrically conductive region 124 interconnects the electrically conductive regions 112,116. The electrically conductive region 136 interconnects the electrically conductive regions 116,114. The electrically conductive region 130 interconnects the electrically conductive regions 120,118. The electrically conductive region 134 interconnects the electrically conductive regions 120,122. The electrically conductive region 132 interconnects the electrically conductive regions 118,122. The electrically conductive region 128 interconnects the electrically conductive regions 114,118. The electrically conductive region 128 extends toward the center of an edge of the lower electrode sheet 110 in the upper direction of Fig. 3 (c). The electrically conductive regions 124 to 136 are formed by the formation of lattice-shaped electrical conductor patters (not shown) on the upper surface of the lower electrode sheet 110.

As seen from a comparison between Figs. 3 (a) and 3 (b), the electrical conductor patters on the upper electrode sheet 70 and those on the lower electrode sheet 110 are formed in a direction in which the former electrical conductor patterns intersect the latter electrical conductor patterns. As seen from Figs. 3 (a) to 3 (c), the spacer 100 has the apertures 102 formed at respective regions corresponding with locations of: the pair of electrically conductive regions 112,72 ; the pair of electrically conductive regions 114,74 ; the pair of electrically conductive regions 116,76 ; the pair of electrically conductive regions 118, 78 ; the pair of electrically conductive regions 120,80 ; and the pair of electrically conductive regions 122,82.

Fig. 4 is a descriptive illustration showing details of the electrically conductive regions 112,124, and 126 of Fig. 3 (c). As illustrated in Fig. 4, electrical conductor patterns 115 and lattice-shaped electrical conductor patterns 113 are formed on the upper surface of the lower electrode sheet 110, thereby forming the electrically conductive regions 112,124, and 126. The electrical conductor patterns 115 and lattice-shaped electrical conductor patterns 113 may be, e. g., screen-printed on the top of the lower electrode sheet 110 in order to form the electrically conductive regions 112,124, and 126 thereon.

The electrical conductor patterns 115 are made coarser in pattern than the electrical conductor patterns 113. Accordingly, the electrical <BR> <BR> conductor patterns 115 may be formed by, e. g. , silver that is higher in conductivity than carbon, but is higher in cost than carbon, while the <BR> <BR> electrical conductor patterns 113 may be formed by, e. g. , carbon that is lower in cost than silver. The other electrically conductive regions 114 to 136 as well as the electrically conductive regions 72 to 94 are similarly formed by the electrical conductor patterns 115 and lattice-shaped electrical conductor patterns 113. Referring to Figs. 3 (a) and 3 (c), as discussed above, the lattice-shaped electrical conductor patterns 113 on the lower electrode sheet 110 and those on the upper electrode sheet 70 are formed in the direction in which they intersect each other.

Referring back to Fig. 2, each of the fabric sheets 140 to 150 is sewed onto the fabric sheet 180 so as to cover a corresponding one of the pads 160 to 170. In the sewing, each of the pads 160 to 170 is positioned below a corresponding one of the stomp regions 46 to 56. The pads 160 to 170 are thus secured in between the fabric sheet 140 to 150 and the fabric sheet 180, thereby forming a pad layer 310.

Fig. 5 is a descriptive illustration showing the pad layer 310 of Fig. 2. As illustrated in Fig. 5, the fabric sheet 140 is sewed onto the fabric sheet 180 using a string 312 so as to cover the pad 160. Each of the other pads 162 to 170 is similarly fixedly secured and located below a corresponding one of the stomp regions 48 to 56.

Fig. 6 is a cross-sectional view showing the mat switch of Fig. 1 along line"A"to"A". As illustrated in Fig. 6, the pad layer 310 (the sheet 180, the pad 160, and the sheet 140) is formed on the top of the <BR> <BR> bottommost layer, i. e. , the reverse sheet 190. The switch layer 300 (the lower electrode sheet 110, the spacer 100 and the upper electrode sheet 70) is formed on the top of the pad layer 310. The shock-absorbing sheet 60 is disposed on the top of the switch layer 300. The obverse sheet 42 <BR> <BR> is provided on the top of the shock-absorbing sheet 60, i. e. , the topmost layer of the mat switch 40.

Referring to Fig. 1, the reverse sheet 190, pad layer 310, switch layer 300, shock-absorbing sheet 60, and obverse sheet 42 thus laminated together are rimmed with a piece of fabric tape 30, and are then sewed together by a string 44. In this way, the mat switch 40 is provided. The fabric tape 30 can be, e. g. , bias tape.

As discussed above, the fabric sheet 140 is sewed onto the fabric sheet 180 using the string 312 so as to cover the pad 160. As discussed above, the spacer 100 is sandwiched between the electrically conductive

region 112 on the upper surface of the lower electrode sheet 110 and the electrically conductive region 72 on the underside of the upper electrode sheet 70 in a state in which these two different electrically conductive regions 72,112 confront one another. Accordingly, when a game player treads on the obverse sheet 42, then the spacer 100 is compressed, thereby bringing the electrically conductive region 72 on the upper electrode sheet 70 into contact with the electrically conductive region 112 on the lower electrode sheet 110 through the apertures 102. As a result, the mat switch 40 is turned on.

Fig. 7 is a cross-sectional view illustrating the mat switch 40 and the information-processing apparatus 20 along line"B"-"B". As illustrated in Fig. 7, the information-processing apparatus 20 includes a cover 22 and a base 23, both of which nip the mat switch 40 at an edge thereof. To nip the mat switch 40, a boss 25 on the cover 22 is inserted into a boss 26 on the base 23. The boss 25 extends downward from the inner surface of the cover 22. The boss 26 extends upward from the inner surface of the base 23. Inside the boss 26, a screw 29 is brought into threading engagement with the boss 25, thereby joining the cover 22 and the base 23 together.

Another screw 28 is inserted through the mat switch 40 to be driven into threading engagement with a boss 27 on the base 23. The boss 27 extends upward from the inner surface of the base 23. As a result, the mat switch 40 is rigidly secured to the information-processing apparatus 20. The cover 22 and base 23 nip the mat switch 40 in order to fixedly attach the mat switch 40 to the information-processing apparatus 20 as well. The cover 22 and base 23 form a housing of the information-processing apparatus 20. <BR> <BR> <P>The cover 22 and base 23 can be made from, e. g. , ABS<BR> (acrylonitrile-butadiene-styrene)-resin.

Fig. 8 is an illustration showing the reverse side of the mat switch 40 of Fig. 1. As illustrated in Fig. 8, the reverse sheet 190 has cleats 51,53, 55, and 57 disposed on the surface thereof. The cleats 57,55, 53, and 51 are arrayed at positions corresponding with the locations of the stomp regions 46,48, 52, and 54, respectively. The cleats 57,55, 53, and 51 can be made of, e. g. , synthetic rubber.

Fig. 9 is an illustration showing an electrical structure of the information-processing apparatus 20 of Fig. l. As illustrated in Fig. 9, the information-processing apparatus 20 includes a high-speed processor 200, a ROM (read-only-memory) 256, a bus 254, a connector 257, a video signal output terminal 250, and an audio signal output terminal 252.

The bus 254 is connected to the high-speed processor 200. The ROM 256 is linked to the bus 254. As a result, the high-speed processor 200

is possible to access the ROM 256 through the bus 254, and consequently to read and then execute a game program from the ROM 256. In addition, the high-speed processor 200 is possible to process and read both image and audio data from the ROM 256 in order to produce video and audio signals, thereby feeding the video and audio signals into the video and audio signal output terminals 250,252, respectively.

The electrically conductive region 128 of the mat switch 40 is connected to a resistor element 258 at one end thereof through the connector 257. The other end of the resistor element 258 is connected to both a power supply"Vcc"and one end of a capacitor 271. The other end of the capacitor 271 is grounded.

The electrically conductive region 84 of the mat switch 40 is connected to a resistor element 259 at one end thereof through the connector 257. The other end (node"N1") of the resistor element 259 is connected to both an input-output port"I01"of the high-speed processor 200 and one end of a capacitor 270. The other end of the capacitor 270 is grounded.

The electrically conductive region 88 of the mat switch 40 is linked to a resistor element 260 at one end thereof through the connector 257. The other end (node"N2") of the resistor element 260 is connected to both an input-output port"102"'of the high-speed processor 200 and one end of a capacitor 269. The other end of the capacitor 269 is grounded. The electrically conductive region 86 of the mat switch 40 is connected to a resistor element 261 at one end thereof through the connector 257. The other end (node"N3") of the resistor element 261 is connected to both an input-output port"I03"of the high-speed processor 200 and one end of a capacitor 268. The other end of the capacitor 268 is grounded.

The electrically conductive region 90 of the mat switch 40 is connected to a resistor element 262 at one end thereof through the connector 257. The other end (node"N4") of the resistor element 262 is connected to both an input-output port"IQ4"of the high-speed processor 200 and one end of a capacitor 267. The other end of the capacitor 267 is grounded.

The electrically conductive region 92 of the mat switch 40 is connected to a resistor element 263 at one end thereof through the connector 257.

The other end (node"N5") of the resistor element 263 is connected to both an input-output port"I05"of the high-speed processor 200 and one end of a capacitor 266. The other end of the capacitor 266 is grounded. The electrically conductive region 94 of the mat switch 40 is connected to a resistor element 264 at one end thereof through the connector 257. The other end (node"N6") of the resistor element 264 is connected to both an input-output port"I06"of the high-speed processor 200 and one end of a

capacitor 265. The other end of the capacitor 265 is grounded.

Respective lines connected to the nodes"N1"to"N6"are pulled down in the high-speed processor 200.

As a result, the electrically conductive regions 112 to 122 on the lower electrode sheet 110 are supplied with power voltage"Vcc"through the resistor element 258. The electrically conductive regions 72 to 82 on the upper electrode sheet 70 are pulled down through the nodes"Nl"to"N6".

As a result, when the game player tramps on the stomp region 46, then the electrically conductive regions 112,72 are forced into contact with one another to permit an electrical current to flow therethrough. This means that a sheet-like switch corresponding with the stomp region 46 is switched on. Similarly, when the game player treads on each of the stomp regions 48 to 56, then a corresponding one of the sheet-like switches is turned on.

When a corresponding one of the sheet-like switches is thus switched on or trampled on for each of the stomp regions 46 to 56, then a corresponding one of the nodes"Nl"to"N6"is brought to a high level. When a corresponding one of the sheet-like switches remains switched off or non-treaded on for each of the stomp regions 46 to 56, then a corresponding one of the nodes "N1"to"N6"is at a low level.

The high-speed processor 200 executes the game program from the ROM 256 to generate video signals, thereby feeding the generated video signals into the video signal output terminal 250. As a result, a game screen is displayed on the TV monitor 1. The high-speed processor 200 executes the game program from the ROM 256 to generate audio signals such as music and sound effects, thereby feeding the generated audio signals into the audio signal output terminal 252. As a result, the TV monitor 1 emits the music and sound effects through a speaker unit (not shown).

When the game player treads on the mat switch 40 in accordance with the game screen displayed on the TV monitor 1, then a corresponding one of the sheet-like switches is switched on for each of the treaded stomp regions 4 6 to 56. The high-speed processor 200 executes game program-ordered information processing in response to ON-OFF information from each of the sheet-like switches of the mat switch 40, thereby proceeding with the game.

Fig. 10 is a block diagram of the high speed processor 200 of Fig.

9. As illustrated in Fig. 10, this high speed processor 200 includes a central processing unit (CPU) 201, a graphic processor 202, a sound processor 203, a DMA (direct memory access) controller 204, a first bus arbiter circuit 205, a second bus arbiter circuit 206, an inner memory 207, an A/D converter (ADC: analog to digital converter) 208, an input/output control circuit

209, a timer circuit 210, a DRAM (dynamic random access memory) refresh control circuit 211, an external memory interface circuit 212, a clock driver 213, a PLL (phase-locked loop) circuit 214, a low voltage detection circuit 215, a first bus 218, and a second bus 219.

The CPU 201 takes control of the entire system and perform various types of arithmetic operations in accordance with the program stored in the memory (the inner memory 207 or the ROM 256). The CPU 201 is a bus master of the first bus 218 and the second bus 219, and can access the resources connected to the respective buses.

The graphic processor 202 is also a bus master of the first bus 218 and the second bus 219, and generates an video signal on the basis of the data as stored in the inner memory 207 or the ROM 256, and output the video signal through the video signal terminal 250. The graphic processor 202 is controlled by the CPU 201 through the first bus 218. Also, the graphic processor 202 has the functionality of outputting an interrupt request signal 220 to the CPU 201.

The sound processor 203 is also a bus master of the first bus 218 and the second bus 219, and generates an audio signal on the basis of the data as stored in the inner memory 207 or the ROM 256, and output the audio signal through the audio signal output terminal 252. The sound processor 203 is controlled by the CPU 201 through the first bus 218. Also, the sound processor 203 has the functionality of outputting an interrupt request signal 220 to the CPU 201.

The DMA controller 204 serves to transfer data from the ROM 256 to the inner memory 207. Also, the DMA controller 204 has the functionality of outputting, to the CPU 201, an interrupt request signal 220 indicative of the completion of the data transfer. The DMA controller 204 is also a bus master of the first bus 218 and the second bus 219. The DMA controller 204 is controlled by the CPU 201 through the first bus 218.

The first bus arbiter circuit 205 accepts a first bus use request signal from the respective bus masters of the first bus 218, performs bus arbitration among the requests for the first bus 218, and issue a first bus use permission signal to one of the respective bus masters. Each bus master is permitted to access the first bus 218 after receiving the first bus use permission signal. In Fig. 10, the first bus use request signal and the first bus use permission signal are illustrated as first bus arbitration signals 222.

The second bus arbiter circuit 206 accepts a second bus use request signal from the respective bus masters of the second bus 219, performs bus arbitration among the requests for the second bus 219, and issue a second

bus use permission signal to one of the respective bus masters. Each bus master is permitted to access the second bus 219 after receiving the second bus use permission signal. In Fig. 10, the second bus use request signal and the second bus use permission signal are illustrated as second bus arbitration signals 223.

The inner memory 207 may be implemented with one or any necessary combination of a mask ROM, an SRAM (static random access memory) and a DRAM in accordance with the system requirements. A battery 217 is provided if an SRAM has to be powered by the battery for maintaining the data contained therein. In the case where a DRAM is used, the so called refresh cycle is periodically performed to maintain the data contained therein.

The ADC 208 converts analog input signals into digital signals. The digital signals are read by the CPU 201 through the first bus 218. Also, the ADC 208 has the functionality of outputting an interrupt request signal 220 to the CPU 201.

The input/output control circuit 209 serves to perform input and output operations of input/output signals to enable the communication with external input/output device (s) and/or external semiconductor device (s). The read and write operations of input/output signals are performed by the CPU 201 through the first bus 218. Also, the input/output control circuit 209 has the functionality of outputting an interrupt request signal 220 to the CPU 201. Incidentally, the input/output signals are input and output through the programmable input-output ports"100"to"1015".

The input/output control circuit 209 receives ON/OFF-signals from the mat switch 40 through the input-output ports"I01"to"I06".

The timer circuit 210 has the functionality of periodically outputting an interrupt request signal 220 to the CPU 201 with a time interval as preset. The setting of the timer circuit 210 such as the time interval is performed by the CPU 201 through the first bus 218.

The DRAM refresh cycle control circuit 211 periodically and unconditionally gets the ownership of the first bus 218 to perform the refresh cycle of the DRAM at a certain interval. Needless to say, the DRAM refresh cycle control circuit 211 is provided in the case where the inner memory 207 includes a DRAM.

The PLL circuit 214 generates a high frequency clock signal by multiplication of the sinusoidal signal as obtained from a crystal oscillator 216.

The clock driver 213 amplifies the high frequency clock signal as received from the PLL circuit 214 to a sufficient signal level to supply the respective blocks with the clock signal 225.

The low voltage detection circuit 215 monitors the power potential Vcc and issues the reset signal 226 of the PLL circuit 214 and the reset signal 227 to the other circuit elements of the entire system when the power potential Vcc falls below a certain voltage. Also, in the case where the inner memory 207 is implemented with an SRAM requiring the power supply from the battery 217 for maintaining data, the low voltage detection circuit 215 serves to issue a battery backup control signal 224 when the power potential Vcc falls below the certain voltage.

The external memory interface circuit 212 has the functionality of connecting the second bus 219 to the external bus 254 and issuing a bus cycle completion signal 228 of the second bus 219 to control the length of the bus cycle of the second bus.

The following discusses another exemplary construction of the mat switch 40 of Fig. 1.

Fig. 11 is a breakaway, perspective view illustrating a modification of the mat switch 40 of Fig. 1. The mat switch 40 of Fig. 11 has a shock-absorbing sheet 60 upwardly disposed on a reverse sheet 190, a switch layer 300 upwardly located on the shock-absorbing sheet 60, a pad layer 310 upwardly positioned on the switch layer 300, and an obverse sheet 42 upwardly provided on the pad layer 310, although the mat switch 40 of Fig.

2 has the pad layer 310 upwardly disposed on the reverse sheet 190, the switch layer 300 upwardly positioned on the pad layer 310, the shock-absorbing sheet 60 upwardly provided on the switch layer 300, and the obverse sheet 42 upwardly provided on the shock-absorbing sheet 60.

The following discusses an exemplary modification of the pad layer 310 of Fig. 2. Referring to Figs. 2 and 11, pursuant to the present modification, the fabric sheet 180 is replaced by a similarly shaped sheet made from polyvinyl chloride of a non-phthalic acid series, while the fabric sheets 140 to 150 are replaced by similarly shaped sheets made from polyvinyl chloride of the non-phthalic acid series. The replaced sheets are welded together. Details of the above are now described with reference to a specific example.

Fig. 12 (a) is an illustrating showing a surface of a modification of the pad layer 310. Fig. 12 (b) is an illustration showing the reverse side of the modified pad layer. As illustrated in Figs. 12 (a) and 12 (b), a sheet 400 made from polyvinyl chloride of the non-phthalic acid is welded onto a sheet 410 made from polyvinyl chloride of the non-phthalic acid so as to cover the pad 160. The pad 160 is thus fixedly secured and located at a position corresponding with that of the stomp region 46. To fix the pad 160, the sheets 400 and 410 are welded together so as to alternate welded

spots 402 with non-welded spots 404. The welding can be, e. g. , ultrasonic welding. The other pads 162 to 170 are similarly fixedly secured to the sheet 410.

The following discusses a further exemplary modification of the pad layer 310 of Fig. 2. Referring to Figs. 2 and 11, pursuant to the present modification, the fabric sheet 180 is replaced by a similarly shaped sheet made from polyvinyl chloride of the non-phthalic acid series, while the fabric sheets 140 to 150 are replaced by similarly shaped sheets made from polyvinyl chloride of the non-phthalic acid series. The replaced sheets are welded together. However, the replaced sheets instead of the fabric sheets 140 to 150 are formed with apertures. Details of the above are now discussed with reference to a specific example.

Fig. 13 (a) is an illustration showing of a surface of a further modification of the pad layer 310. Fig. 13 (b) is an illustration showing the reverse side of the modified pad layer. As illustrated in Fig. 13 (a) and 13 (b), a sheet 420 made from polyvinyl chloride of the non-phthalic acid series is welded onto a sheet 410 made from polyvinyl chloride of the non-phthalic acid series so as to cover the pad 160. In this way, the pad 160 is rigidly secured and located at a position corresponding to that of the stomp region 46. To fix the pad 160, the sheets 420,410 are welded together without allowing non-welded spots being formed therebetween. As a result, different from Fig. 12, a welded spot 406 is seamlessly formed.

However, the sheet 420 is defined with several apertures 408. The welding <BR> <BR> can be, e. g. , ultrasonic welding. The other pads 162 to 170 are similarly rigidly secured to the sheet 410.

Alternatively, the sheet 420 defined with the apertures 408 may be replaced by a punched sheet 410. In the alternative, the sheet 410 has apertures formed within the range of a position where the pad 160 is situated.

As a further alternative, both of the sheets 410,420 may be punched.

The following discusses exemplary use of the mat switch 40. In the following discussion, the stomp regions 46 to 56 and corresponding sheet-like switches are synonymously referred to. A stomp on a stomp region means that a corresponding sheet-like switch is switched on.

For example, a single game player uses either one gang of the stomp regions 46,48, 50 or another of the stomp regions 52,54, 56. For two game <BR> <BR> players, e. g. , first and second players may use one gang of the stomp regions 46,48, 50 and another of the stomp regions 52,54, 56, respectively.

Accordingly, the information-processing apparatus 20 recognizes ON-OFF information from the stomp regions 46, 48, 50 and that from the stomp regions 52,54, 56 as first player operation-and second player operation-produced

information, respectively, and vice versa. Alternatively, one gang of the stomp regions 46,48, 50 and another of the stomp regions 52,54, 56 may be used as left and right leg-dedicated treads, respectively.

As a further alternative, the stomp regions 46,48 may be treaded on to move a cursor in leftward and rightward directions, respectively, while the stomp region 50 may be used as a decision button. More specifically, the information-processing apparatus 20 allows the cursor displayed on the TV monitor 1 to be moved leftward when the stomp region 46 is treaded on, but to be moved rightward when the stomp region 48 is tramped on. The information-processing apparatus 20 starts executing predetermined processing when the stomp region 50 is stomped on.

As a yet further alternative, the information-processing apparatus 20 may match the stomp regions 46 to 56 with objects displayed on the TV monitor 1, thereby varying a corresponding one of the objects when any one of the stomp regions 46 to 56 is tramped on.

For example, the information-processing apparatus 20 may vary the objects displayed on the TV monitor 1 when a predetermined combination of several ones of the stomp regions 46 to 56 is treaded on.

For example, the information-processing apparatus 20 may vary the objects displayed on the TV monitor 1 when the game player's feet leave a predetermined combination of several ones of the stomp regions 46 to 56, or, e. g. , when the game player jumps off.

For example, the information-processing apparatus 20 may count the number of times of stomping (a) predetermined several one (s) of the stomp regions 46 to 56 per predetermined time, thereby varying the objects displayed on the TV monitor 1 in accordance with the counted value.

For example, the information-processing apparatus 20 can recognize, as a processing-waiting mode, the processing of non-treaded one (s) of the stomp regions 46 to 56. As a result, the information-processing apparatus 20 executes predetermined processing of treaded one (s) of the stomp regions 46 to 56. Alternatively, for example, the information-processing apparatus 20 can recognize, as the processing-waiting mode, the processing of treaded one (s) of the stomp regions 46 to 56. As a result, the information-processing apparatus 20 executes predetermined processing of one (s) of the stomp regions 46 to 56, with which either one or both of the game player's feet is out of contact.

For example, the information-processing apparatus 20 may vary the objects displayed on the TV monitor 1 in accordance with time in which (a) predetermined one (s) of the stomp regions 46 to 56 is (or are) treaded on.

Alternatively, for example, the information-processing apparatus 20 may

vary the objects displayed on the TV monitor 1 in accordance with time in which (a) predetermined one (s) of the stomp regions 46 to 56 is (or are) non-treaded on.

For example, the information-processing apparatus 20 may display objects on the TV monitor 1 when (a) predetermined one (s) of the stomp regions 46 to 56 is (or are) treaded on. Alternatively, for example, the information-processing apparatus 20 may display objects on the TV monitor 1 when (a) predetermined one (s) of the stomp regions 46 to 56 is (or are) non-treaded on.

The variations in the objects displayed on the TV monitor 1 include, <BR> <BR> e. g. , respective variations in object position, form, or color, or a combination thereof.

For example, the information-processing apparatus 20 may start executing predetermined information processing of treaded one (s) of the stomp regions 46 to 56. Alternatively, for example, the information-processing apparatus 20 may start executing predetermined information processing of one (s) of the stomp regions 46 to 56, with which either one or both of the game player's feet is out of contact. The predetermined information processing as discussed above includes various <BR> <BR> types of information processing such as, e. g. , the recording, regeneration, and processing of images displayed on the TV monitor 1, the generation and <BR> <BR> processing of sound (e. g. , music and sound effects), and game processing.

As described above, pursuant to the present embodiments, the pad layer 310 is disposed upwardly on the reverse sheet 190. As a result, the fabric sheet 180 (or the sheet 410), on which the pad-covering sheets or rather the fabric sheets 140 to 150 (or the sheets 400,420) are placed, are held out of direct contact with the floor. This feature prevents possible breakage of the mat switch 40 to the utmost extent, which otherwise might occur as a result of the fabric sheets 140 to 150 (or the sheets 400,420) being placed on the fabric sheet 180 (or the sheet 410).

Referring to Fig. 5, pursuant to the present embodiments, the sheets 140 to 150 as well as the sheet 180 are formed by fabrics, and are therefore gas-permeable. As a result, when the stomp regions 46 to 56 are treaded on, then air is blown out of the space enclosed by the sheets 140 to 150 <BR> <BR> and the sheet 180 (i. e. , the space in which the pads 160 to 170 are present).

That is, the air is expelled from the aforesaid space to the outside through the sheets 140 to 150 and the sheet 180. Consequently, a rise in pressure of the space surrounded by the sheets 140 to 150 and the sheet 180 is inhibited, which otherwise would result from stomps on the mat switch 40. This feature prevents possible damage of the sheets 140 to 150 and 180 to the utmost

extent, which otherwise might result from a rise in internal pressure of the above space.

Referring to Fig. 13, pursuant to the present embodiments, the sheet 420 is formed with the apertures 408, and is therefore gas-permeable. As a result, when the stomp regions 46 to 56 are treaded on, then air is blown <BR> <BR> out of the space enclosed by the sheets 420,410 (i. e. , the space in which the pads 160 to 170 are present). That is, the air is expelled from the aforesaid space to the outside through the apertures 408 of the sheet 420.

Consequently, a rise in pressure of the space surrounded by the sheets 420, 410 is suppressed, which otherwise would result from the stomps on the mat switch 40. This feature avoids damaging the sheets 410,420 to the utmost extent, which otherwise might result from elevated internal pressures of the above space.

Referring to Fig. 12, pursuant to the present embodiments, the sheet 400 is attached to the sheet 410 in such a manner as to permit air to flow through between the space enclosed by the sheets 400,410 and the external space around the former space, and to cover the pads 160 to 170. More specifically, as seen from Fig. 12, the sheet 400 is welded onto the sheet 410 so as to alternate the welded spots 402 with the non-welded spots 404.

As a result, when the stomp regions 46 to 56 are stomped on, then <BR> <BR> air is blown out of the space enclosed by the sheets 400,410 (i. e. , the space in which the pads are present). That is, the air is expelled from the aforesaid space to the outside through the non-welded spots 404.

Consequently, a rise in pressure of the space defined by the sheets 400, 410 is suppressed, which otherwise would result from the stomps on the mat switch 40. This feature guards the sheets 400,410 against damage to the utmost extent, which otherwise might result from elevated internal pressures of the above space.

Referring to Fig. 2, pursuant to the present embodiments, the shock-absorbing sheet 60 is provided beneath the obverse sheet 42, with which the bottoms of the game player's feet are held in direct contact.

This construction alleviates stomp-caused shocks, and avoids damaging the switch layer 300 to the utmost extent.

Referring to Fig. 11, pursuant to the present embodiments, the shock-absorbing sheet 60 is disposed on the reverse sheet 190 that is held in direct contact with the floor. This construction avoids damaging the switch layer 300 to the utmost extent, which otherwise might result from a stomp-caused thrust against the floor.

Referring to Fig. 3, pursuant to the present embodiments, the upper and lower electrode sheets 70,110 are formed with the lattice-shaped

electrical conductor patterns 113 in such a manner that the lattice-shaped electrical conductor patterns 113 on the upper electrode sheet 70 intersect those on the lower electrode sheet 110. As a result, the electrical conductor patterns 113 on the upper electrode sheet 70 readily contact those on the lower electrode sheet 110, when compared with electrical conductor patters that extend in the same direction. This feature realizes high-sensitive detection of the stomps on the mat switch 40.

Referring to Fig. 4, pursuant to the present embodiments, the electrically conductive regions 80 to 92 and 112 to 136 are formed partially by silver that is greater in conductivity than carbon. As a result, higher-sensitive detection of the stomps on the mat switch 40 is achievable, when compared with the case where the electrically conductive regions 80 to 92,112 to 136 are formed only by carbon. Meanwhile, the electrically conductive regions 80 to 92 and 112 to 136 are formed dominantly by carbon that is lower in cost than silver. As a result, the high-cost silver is consumed in amount adjustable in view of cost.

Referring to Fig. 3, pursuant to the present embodiments, the sheet-like switches are coextensively provided. As a result, several individuals can share the single mat switch 40. In this instance, the individuals can tread on the sheet-like switches at one time. Alternatively, a single person can tread on the sheet-like switches by moving the feet either synchronously or alternately. Each of the sheet-like switches may be provided with a different function. As a result, the mat switch 40 is available in wider applications.

The present invention is not limited to the above embodiments, but is susceptible to various variations and modifications without departing from the sprits and scope of the invention. For example, variations as discussed below are acceptable.

1. Pursuant to the present embodiments, six numbers of the sheet-like switches are used. However, the number of sheet-like switches is not limited thereto. Either a single or several sheet-like switches except for six switches are acceptable. The sheet-like switches are not limited in array to the above embodiments, but may be arrayed in any other fashions.

2. Pursuant to the above embodiments, the lattice-shaped electrical conductor patterns 113 are used, but the present invention is not limited thereto. Any other types of electrical conductor patterns may be employed.

The electrical conductor pattern 115 is not limited to the above embodiments, but any other types of electrical conductor patterns may be employed.

3. Pursuant to the above embodiments, the electrical conductor patterns 113,115 form the electrically conductive regions 72 to 92,112

to 136. Alternatively, either only the electrical conductor patterns 113 or only the electrical conductor patterns 115 may form them.

4. The above embodiments provide the shock-absorbing sheet 60, but it need not always be provided. A further layer may be added to the existing layers that form the mat switch 40.

5. Pursuant to the present embodiments, the sheet-like switches are formed by the electrically conductive regions 72 to 82, the spacer 100, and the electrically conductive regions 112 to 122. However, the sheet-like switches are not limited thereto. An alternative to the spacer 100, e. g., may be disposed on either the upper electrode sheet 70 or the lower electrode sheet 110.

6. Pursuant to the present embodiments, the information-processing apparatus 20 is secured to the mat switch 40, but needs not always be combined therewith. Alternatively, the information-processing apparatus 20 may be separated from the mat switch 40.

7. Although the present embodiments illustrate a game system as an exemplary information-processing system, the present invention is not limited in service application thereto. For example, the present invention is applicable to a training system and a simulated experience system.

8. In the pad layer 310 as illustrated in Figs. 2 and 11, the pads 16. 0 to 170 are positioned on the fabric sheet 180; and the fabric sheet 140 to 150 are disposed on the pads 160 to 170.

Alternatively, the pads 160 to 170 may be provided on the fabric sheets 140 to 150; and the fabric sheet 180 may be disposed on the pads 160 to 170, thereby forming an alternative pad layer 310.

9. Although any kinds of processors may be employed as the high-speed processor 200 of Fig. 9, a high-speed processor having already been patent-applied for by the present Applicant is preferably used. The patent-applied high-speed processor is disclosed in detail in, e. g., published Japanese Patent Application Laid-Open No. (HEI) 10-307790 and corresponding U. S. Patent No. 6,070, 205.

The foregoing description of the embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and obviously many modifications and variations are possible in light of the above teaching.

The embodiment was chosen in order to explain most clearly the principles of the invention and its practical application thereby to enable others in the art to utilize most effectively the invention in various embodiments and with various modifications as are suited to the particular use contemplated.