Title:
MATCHING CIRCUIT AND HIGH-FREQUENCY AMPLIFIER
Document Type and Number:
WIPO Patent Application WO/2017/033334
Kind Code:
A1
Abstract:
The present invention is configured in such a way that a bonding wire (19) connects one end of a main line (13) formed on a dielectric substrate (11) to one end of a main line (16) formed on a dielectric substrate (12), and a bonding wire (27) connects the other end of a branched line (21) formed on the dielectric substrate (12) to the other end of a branched line (23) formed on the dielectric substrate (11). This configuration can suppress impedance mismatching caused by a variation in distance between the dielectric substrate (11) and the dielectric substrate (12) due to an inconsistency in assembly occurring during manufacturing.
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Inventors:
KAMIOKA JUN (JP)
YAMANAKA KOJI (JP)
HANGAI MASATAKE (JP)
YAMANAKA KOJI (JP)
HANGAI MASATAKE (JP)
Application Number:
PCT/JP2015/074248
Publication Date:
March 02, 2017
Filing Date:
August 27, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H03H7/38
Foreign References:
| JPS58221512A | 1983-12-23 | |||
| JPH0230201A | 1990-01-31 | |||
| JP2003197760A | 2003-07-11 | |||
| JP2009284005A | 2009-12-03 | |||
| JP2015042001A | 2015-03-02 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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