Title:
MATERIAL EVALUATION DEVICE, MATERIAL EVALUATION METHOD, AND MATERIAL EVALUATION PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/260883
Kind Code:
A1
Abstract:
In order to efficiently acquire a physical value of a material, N hysteresis curves (40) (where N is an integer equal to or greater than 2) indicating a change in a physical quantity (Q) for each of N changes in a physical quantity (P) at certain coordinates (a) of a material (30) are stored in a storage unit (10) of a material evaluation device 1. For example, the physical quantity (P) is a temperature, and the physical quantity (Q) is a deformation amount. A processing unit (20) generates one-dimensional information (41) relating to the physical quantity (Q) by arranging, in one dimension, points extracted by referring to the storage unit (10) to scan by the value of a prescribed physical quantity (Q) for each of the N hysteresis curves at the coordinates (a), and calculates a physical value of the material (30) using the one-dimensional information (41). For example, an instance of a variation point is derived from the one-dimensional information (41) of N instances, and linear and nonlinear physical values of the material (30) are calculated on the basis of a transition in the physical quantity (Q) from an instance before the variation point and an instance after the variation point.
Inventors:
SOEDA TAKESHI (JP)
Application Number:
PCT/JP2020/025020
Publication Date:
December 30, 2021
Filing Date:
June 25, 2020
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
G01N3/32
Foreign References:
| JPH02302647A | 1990-12-14 | |||
| JP2007057325A | 2007-03-08 | |||
| JP2018173357A | 2018-11-08 | |||
| JP2011203042A | 2011-10-13 | |||
| JP2017187472A | 2017-10-12 | |||
| JP2011215140A | 2011-10-27 | |||
| JP2010185792A | 2010-08-26 | |||
| JP2003270060A | 2003-09-25 | |||
| US6301970B1 | 2001-10-16 | |||
| CN105158084A | 2015-12-16 | |||
| JP2007309801A | 2007-11-29 | |||
| JP2011203042A | 2011-10-13 |
Other References:
"Advanced Physical Modelling Method to the LSI Package Deformation with the HOG Image Feature", ADVANCED METALLIZATION CONFERENCE 2019 (ADMETA PLUS, 2019
Attorney, Agent or Firm:
FUSO INTERNATIONAL PATENT FIRM (JP)
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