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Title:
MATERIAL AND PREPARATION METHOD THEREFOR, APPLICATION OF MATERIAL, AND ABRASIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/104041
Kind Code:
A1
Abstract:
Provided are a material and a preparation method therefor, an application of the material, and an abrasive material. The material comprises a polymer substrate and foamed microspheres distributed in the polymer substrate, wherein the foamed microspheres each comprise a shell layer and a cellular structure formed by wrapping of the shell layer, and the average spacing between adjacent cellular structures is less than or equal to 100 µm. The average spacing between adjacent cellular structures of the material is less than or equal to 100 µm, such that the material formed in this way has a rich pore structure and has a density of less than 0.4 g/cm3. The density of the material is decreased, and therefore, when the material is used as an abrasive material, wear of the abrasive material on an abrasive material finisher can be reduced, the process stability of an abrading process is improved, and the maintenance of the stable roughness of the abrasive material during abrasion is facilitated.

Inventors:
LI MIN (CN)
ZHANG KE (CN)
FAN YIPING (CN)
LIU QIANG (CN)
YANG QING (CN)
LEI JINGXIN (CN)
Application Number:
PCT/CN2022/136984
Publication Date:
June 15, 2023
Filing Date:
December 06, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
B24B37/24; C08J9/32; C08G18/10; C08J9/12; C08L75/04
Foreign References:
CN108047420A2018-05-18
CN102627749A2012-08-08
CN113061284A2021-07-02
US20150059254A12015-03-05
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