MATERIAL FOR PRINTED CIRCUIT BOARD, METAL LAMINATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

WIPO Patent Application WO/2016/181936

A1

Provided are: a material for printed circuit boards which resists warping at high temperature (150-200°C) while maintaining electrical properties; a metal laminate; a method for manufacturing the same; and a method for manufacturing a printed circuit board. A material having a fluorine-containing resin layer is subjected to a heat treatment. The fluorine-containing resin layer comprises a composition containing a fluorine-containing copolymer (a) which has at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, and an isocyanate group, has a melting point of 280-320°C, and has a melt flow rate of at least 2 g per 10 minutes as measured under a load of 49 N at 372°C. The heat treatment is performed at a temperature which is equal to or higher than 250°C but lower than the melting point of the fluorine-containing copolymer (a) by at least 5°C such that the ratio of the melt flow rates of the fluorine-containing resin layer before and after the heat treatment and the value of the melt flow rate of the fluorine-containing resin layer after the heat treatment respectively fall within specific ranges.

HOSODA TOMOYA (JP)
KASAI WATARU (JP)
SASAKI TORU (JP)
ABE MASATOSHI (JP)

PCT/JP2016/063760

November 17, 2016

May 09, 2016

Click for automatic bibliography generation  

ASAHI GLASS CO LTD (JP)

H05K1/03; B32B27/30; C09J7/25; C09J7/35; C09J127/12; C09J135/00

WO2010084867A1	2010-07-29
WO2015002251A1	2015-01-08

JPH10264327A

1998-10-06

SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)

View/Download PDF      PDF Help

Previous Patent: AQUEOUS SUSPENSION AGENT COMPRISING GLUCOCORTICOSTEROID NANOPARTICLES

Next Patent: BATTERY-ENCAPSULATING INSTRUMENT, BATTERY ASSEMBLY, AND MEDICAL DEVICE UNIT