Title:
MATERIAL SUPPLY DEVICE FOR LAMINATE MOLDING DEVICE, LAMINATE MOLDING DEVICE, AND LAMINATE MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/145812
Kind Code:
A1
Abstract:
A material supply device according to one embodiment of the present invention is provided with a supply section. The supply section comprises: an accommodation section that is capable of accommodating a powdered material; and a first wall that is provided with a plurality of first openings that are connected to the accommodation section, and that at least partially covers an area to which the material is supplied. A layer of the material is formed by supplying the material that is in the accommodation section to the area from the plurality of first openings.
Inventors:
TANAKA MASAYUKI (JP)
OHNO HIROSHI (JP)
TERADA TAKAHIRO (JP)
DEURA KAORI (JP)
OHNO HIROSHI (JP)
TERADA TAKAHIRO (JP)
DEURA KAORI (JP)
Application Number:
PCT/JP2014/073982
Publication Date:
October 01, 2015
Filing Date:
September 10, 2014
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
B29C67/00; B22F3/105
Domestic Patent References:
| WO2007013240A1 | 2007-02-01 |
Foreign References:
| JP2002307562A | 2002-10-23 | |||
| JP2001158520A | 2001-06-12 | |||
| JP2001334583A | 2001-12-04 |
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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