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Patent Searching and Data


Title:
MATERIAL FOR THREE-DIMENSIONAL MODELING, FILAMENT FOR THREE-DIMENSIONAL MODELING, ROLL OF SAID FILAMENT, AND CARTRIDGE FOR THREE-DIMENSIONAL PRINTER
Document Type and Number:
WIPO Patent Application WO/2019/151234
Kind Code:
A1
Abstract:
A material for three-dimensional modeling, which contains a styrene resin and is used in a fused deposition modeling type three-dimensional printer. This material for three-dimensional modeling has at least one glass transition temperature (Tg) within the range of from 50°C (inclusive) to 100°C (exclusive).

Inventors:
HIRANO, Akiko (1-1 Marunouchi 1-chome, Chiyoda-k, Tokyo 51, 〒1008251, JP)
Application Number:
JP2019/002945
Publication Date:
August 08, 2019
Filing Date:
January 29, 2019
Export Citation:
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Assignee:
MITSUBISHI CHEMICAL CORPORATION (1-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 51, 〒1008251, JP)
International Classes:
B29C64/118; B29C64/259; B33Y30/00; B33Y70/00
Domestic Patent References:
WO2018003379A12018-01-04
WO2017130469A12017-08-03
Foreign References:
JP2014511933A2014-05-19
JP2016505409A2016-02-25
JP2016079379A2016-05-16
JP2016037571A2016-03-22
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (Nissin bldg, 9F 5-10, Shinjuku 2-chome, Shinjuku-k, Tokyo 22, 〒1600022, JP)
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