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Title:
MATERIAL FOR THREE-DIMENSIONAL MODELING, FILAMENT FOR THREE-DIMENSIONAL MODELING, ROLL OF SAID FILAMENT, AND CARTRIDGE FOR THREE-DIMENSIONAL PRINTER
Document Type and Number:
WIPO Patent Application WO/2019/151235
Kind Code:
A1
Abstract:
A material for three-dimensional modeling, which is used in a fused deposition modeling type three-dimensional printer, and which has a multilayer structure wherein a thermoplastic resin (A) that has a shear storage elastic modulus (G') of 1.00 × 107 Pa or less as determined at 100°C at 1Hz and a thermoplastic resin (B) that has a shear storage elastic modulus (G') of more than 1.00 × 107 Pa as determined at 100°C at 1Hz are contained in different layers.

Inventors:
HIRANO AKIKO (JP)
FUROMOTO SHIGEYUKI (JP)
Application Number:
JP2019/002946
Publication Date:
August 08, 2019
Filing Date:
January 29, 2019
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B29C64/118; B29C64/259; B33Y30/00; B33Y70/00
Foreign References:
JP2016193601A2016-11-17
US20160122541A12016-05-05
US20170298521A12017-10-19
US20170320266A12017-11-09
JP2017094703A2017-06-01
JP2017065111A2017-04-06
JP2008194968A2008-08-28
JP2002500584A2002-01-08
JP2016193602A2016-11-17
JPS5920859B21984-05-16
JP2018017467A2018-02-01
JP2018108999A2018-07-12
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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