MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR

Title:

MEASUREMENT SENSOR PACKAGE AND MEASUREMENT SENSOR

Document Type and Number:

WIPO Patent Application WO/2017/130520

Kind Code:

A1

Abstract:

The present invention pertains to a measurement sensor package and a measurement sensor which enable high precision measurement by suppressing the influence of noise. A measurement sensor package 1 includes a substrate 2. The substrate 2 includes: a first accommodation recess 20a having a first bottom surface 20d on which a light-emitting element is mounted and a first step surface 20f on which a first connection pad 23a is disposed; and a second accommodation recess 20b having a second bottom surface 20e on which a light-receiving element is mounted and a second step surface 20g on which a second connection pad 23b is disposed. In a plan view, the first step surface 20f is situated outside the first bottom surface 20d and the second step surface 20g is situated outside the second bottom surface 20e, in a direction connecting the center c1 of the first bottom surface 20d to the center c2 of the second bottom surface 20e.

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Inventors:

OODE YASUSHI (JP)
ITO HIROKI (JP)
SUGIMOTO YOSHIMASA (JP)
NIINO NORITAKA (JP)
MATSUNAGA SHOGO (JP)
HAYASHI TAKUYA (JP)

Application Number:

PCT/JP2016/083434

Publication Date:

August 03, 2017

Filing Date:

November 10, 2016

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

G01P5/26; A61B5/02; A61B5/0285; G01P5/00

Foreign References:

JP3882756B2	2007-02-21
JP4475601B2	2010-06-09
JP5031894B2	2012-09-26
JPS5031895B1	1975-10-16

Other References: