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Patent Searching and Data


Title:
MEASUREMENT SYSTEM AND MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2015/163307
Kind Code:
A1
Abstract:
In order to measure the shift in alignment between an upper layer pattern and a lower layer pattern with high accuracy by scanning with an electron beam, an electron beam is scanned over an area that includes first and second patterns on a sample having, on a substrate, a lower layer pattern (first pattern) and an upper layer pattern (second pattern) that is formed in a step subsequent to the first pattern. In a plurality of pattern position measurement areas defined within the area scanned with the electron beam, the electron beam is scanned such that the scanning direction and sequence of the electron beam is axial-symmetric or point-symmetric, thereby reducing measurement error caused by asymmetry of electrostatic charge.

Inventors:
HOTTA SHOJI (JP)
KAWADA HIROKI (JP)
INOUE OSAMU (JP)
Application Number:
PCT/JP2015/062062
Publication Date:
October 29, 2015
Filing Date:
April 21, 2015
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01B15/00; G01B15/04; H01J37/22; H01L21/027; H01L21/66
Domestic Patent References:
WO2012001883A12012-01-05
Foreign References:
JP2014016174A2014-01-30
JPH09180667A1997-07-11
JPH08506685A1996-07-16
JP2000243695A2000-09-08
JP2001189263A2001-07-10
Attorney, Agent or Firm:
POLAIRE I. P. C. (JP)
Polaire Intellectual Property Corporation (JP)
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