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Patent Searching and Data


Title:
MEASURING DEVICE AND METHOD FOR MEASURING SURFACE OF SAMPLE
Document Type and Number:
WIPO Patent Application WO/2020/075385
Kind Code:
A1
Abstract:
A measuring device, for irradiating a sample having an uneven portion with a charged particle beam and measuring the shape of the sample, irradiates the sample with the charged particle beam at any angle, generates a profile indicating a relationship between an irradiation position and an intensity of emitted electrons, and performs an analysis process for analyzing the shape of the sample by using two profiles.

Inventors:
DOBASHI TAKASHI (JP)
SHINTANI ATSUKO (JP)
SAKAKIBARA MAKOTO (JP)
KIM HYEJIN (JP)
TAMAKI HIROKAZU (JP)
HIROSE KOTOKO (JP)
Application Number:
PCT/JP2019/031904
Publication Date:
April 16, 2020
Filing Date:
August 14, 2019
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
H01J37/22; G01B15/04; H01J37/147; H01J37/20
Domestic Patent References:
WO2018052083A12018-03-22
WO2017179138A12017-10-19
WO2015083548A12015-06-11
Foreign References:
JP2019087518A2019-06-06
JP2017062174A2017-03-30
JP2017016791A2017-01-19
US20170102343A12017-04-13
Attorney, Agent or Firm:
TOU-OU PATENT FIRM (JP)
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