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Patent Searching and Data


Title:
MECHANICAL BONDING DEVICE AND MECHANICAL BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/002975
Kind Code:
A1
Abstract:
A mechanical bonding device is provided which can stably perform rivet bonding even when, in bonding multiple metal plates, the deformation resistance of the metal plates is high. This mechanical bonding device drives rivets into the multiple metal plates by means of a punch, and is provided with a punch and die, a plate press, and a power source device. The punch and die are arranged opposite of each other on either side of the metal plates. The plate press is a cylindrical body into which the punch can be inserted, the plate press can press the multiple metal plates with one end contacting the metal plate that is disposed to the punch side of the multiple metal plates, and the plate press is configured from an electrode material which can be heated by electrification. The punch is configured from a material that can drive rivets, the die is configured from an electrode material which can support the multiple metal plates and which can be heated by electrification. The power source device is configured to start electrification of the plate press and the die so as to raise the temperature of the multiple metal plates at the same time as the starting driving, and electrifies the plate press and the die until the driving has ended.

Inventors:
FURUSAKO, Seiji (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
OKADA, Tohru (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
MIYAZAKI, Yasunobu (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
WATANABE, Fuminori (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
NAKAZAWA, Yoshiaki (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
Application Number:
JP2016/069718
Publication Date:
January 05, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORPORATION (6-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 71, 〒1008071, JP)
International Classes:
B21J15/00
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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