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Title:
MECHANICAL BONDING DEVICE AND MECHANICAL BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/002976
Kind Code:
A1
Abstract:
A mechanical bonding device is provided which enables reducing damage to the periphery, including the rivet, of a bonded joint obtained by rivet bonding. This mechanical bonding device for driving a rivet into multiple metal plates by means of a punch is provided with a punch and die, a plate press, a first power source device, a second power source device and a cooling device. The first power source device electrifies the plate press and the die so as to raise the temperature of the multiple metal plates prior to driving a rivet by means of the punch; the second power source device electrifies the punch and die so as to electrify and heat treat the rivet after driving the rivet by means of the punch; and the cooling device is connected to the punch and cools the rivet after the rivet has been heat treated.

Inventors:
FURUSAKO, Seiji (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
OKADA, Tohru (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
MIYAZAKI, Yasunobu (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
WATANABE, Fuminori (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
NAKAZAWA, Yoshiaki (6-1 Marunouchi 2-chome, Chiyoda-k, Tokyo 71, 〒1008071, JP)
Application Number:
JP2016/069719
Publication Date:
January 05, 2017
Filing Date:
July 01, 2016
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORPORATION (6-1 Marunouchi 2-chome, Chiyoda-ku Tokyo, 71, 〒1008071, JP)
International Classes:
B21J15/00
Domestic Patent References:
2014-12-11
Foreign References:
US20100083481A12010-04-08
JPH1133664A1999-02-09
JP2007521964A2007-08-09
CN103600017A2014-02-26
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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