Title:
MECHANICAL VIBRATION TYPE ELECTRET BONE VOICEPRINT SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/142866
Kind Code:
A1
Abstract:
The present application provides a mechanical vibration type electret bone voiceprint sensor, comprising a PCB and a housing fixed on the PCB, a packaging structure being formed between the housing and the PCB. A mechanical vibration member and an electrode plate are arranged in the packaging structure, and the mechanical vibration member and the electrode plate are arranged in parallel to form a pickup unit. By using the utility model, the problems that a traditional electret bone voiceprint sensor is high in cost, low in product assembly yield, and poor in reliability can be solved.
Inventors:
PEI ZHENWEI (CN)
Application Number:
PCT/CN2022/143357
Publication Date:
August 03, 2023
Filing Date:
December 29, 2022
Export Citation:
Assignee:
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD (CN)
International Classes:
H04R9/06; H04R9/02
Foreign References:
| CN217591077U | 2022-10-14 | |||
| CN212278464U | 2021-01-01 | |||
| CN212992606U | 2021-04-16 | |||
| JP2001095097A | 2001-04-06 | |||
| JP2011223324A | 2011-11-04 |
Attorney, Agent or Firm:
GRANDER IP LAW FIRM (CN)
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