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Patent Searching and Data


Title:
MEDICAL FABRIC
Document Type and Number:
WIPO Patent Application WO/2019/131148
Kind Code:
A1
Abstract:
Provided is a high-density medical fabric that can be suitably used as a graft for a branched stent graft, can accommodate diameter changes, has the burst strength required of a material to be implanted in a body, and has a seamless tubular shape that can narrow in diameter. This high-density medical fabric is characterized by satisfying the conditions (1), (2), (3), and (4). (1) Both warp and weft yarns are synthetic multifilament fibers having a total fiber fineness of 60 dtex or less. (2) The fabric is provided with a large-diameter part, two branch parts having summed diameters smaller than the diameter of the large-diameter part, and a tapered part interposed between the large-diameter part and the two branch parts, the large-diameter part having a 1/1 plain woven structure, the two branch parts having, for example, a 1/2 ribbed woven structure, and the tapered part having a structure in which these woven structures alternate to form a triangle shape. (3) In each of the large-diameter part and the two branch parts, the fabric has a cover factor of 1600 to 2400. (4) In each of the large-diameter part and the two branch parts, the fabric has a thickness of 110 µm or less.

Inventors:
OKUNO, Tokio (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
FUKUDA, Ryo (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
Application Number:
JP2018/045747
Publication Date:
July 04, 2019
Filing Date:
December 12, 2018
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA (1-1-2 Yurakucho, Chiyoda-ku Tokyo, 06, 〒1000006, JP)
International Classes:
A61F2/07; A61L31/06; A61L31/12; A61L31/14; D03D1/00; D03D3/02
Domestic Patent References:
WO2017126009A12017-07-27
Foreign References:
JP2016123764A2016-07-11
US20090171450A12009-07-02
US20050240261A12005-10-27
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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