Title:
MEDICINAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/179757
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).
Inventors:
ENDO TAKAFUMI (JP)
NISHITA TOKIO (JP)
NISHITA TOKIO (JP)
Application Number:
PCT/JP2020/008784
Publication Date:
September 10, 2020
Filing Date:
March 03, 2020
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G59/14; G03F7/11; G03F7/26; H01L21/027
Domestic Patent References:
| WO2007148627A1 | 2007-12-27 | |||
| WO2009104685A1 | 2009-08-27 | |||
| WO2018203540A1 | 2018-11-08 |
Foreign References:
| JP2015038534A | 2015-02-26 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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