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Patent Searching and Data


Title:
MEDIUM PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/091841
Kind Code:
A1
Abstract:
This medium processing device has: a housing section for housing a medium; and a guide that is provided to the housing section and that guides the medium housed in the housing section. The guide has an engagement section that can elastically deform and that is such that the position of the guide is affixed by means of the engagement section engaging the housing section. The position of the guide can be altered by means of deforming the engagement section to release the engagement to the housing section, and the position of the guide is affixed once again by returning the deformed engagement section to the original shape thereof. The engagement section may contain: a first engagement section that affixes the position of the guide by engaging the housing section; and a second engagement section that can elastically deform and that maintains the engagement of the first engagement section and the housing section by means of engaging the housing section.

Inventors:
OOIWA AKIRA (JP)
Application Number:
PCT/JP2013/080044
Publication Date:
June 19, 2014
Filing Date:
November 06, 2013
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD (JP)
International Classes:
G07D9/00; B65H1/04
Foreign References:
JPH01209227A1989-08-23
JPH06115716A1994-04-26
JP2002037463A2002-02-06
JP2002255360A2002-09-11
JP2010195521A2010-09-09
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (JP)
Nakajima 淳 (JP)
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