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Patent Searching and Data


Title:
MELT-BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/107408
Kind Code:
A1
Abstract:
Provided is a device 1 having a pair of molds 10a and 10b that sandwich a portion in which a plurality of film-form members are stacked to heat and melt-bond said film-form members, a pair of heater blocks 20a and 20b for respectively supporting the pair of molds, a plurality of first support blocks 37 connected to one of the heater blocks 20a via a plurality of rod-shaped members 50 that include therein a portion that inhibits heat transmission, a plurality of second support blocks 38 connected to the other heater block 20b via a plurality of rod-shaped members 50, and a drive mechanism 60 that varies the distance between the pair of molds to sandwich the film-form members via these support blocks. The plurality of first support blocks include at least one movable support block 39 including a mechanism 35 for moving in a first direction with respect to the drive mechanism in response to first-direction thermal deformation of the heater block being supported, and the plurality of second support blocks include at least one movable support block 39.

Inventors:
YAMAURA, Seiji (401, Shimomaruko, Ueda-sh, Nagano 06, 〒3860406, JP)
KOJIMA, Hirotaka (401, Shimomaruko, Ueda-sh, Nagano 06, 〒3860406, JP)
Application Number:
JP2018/043778
Publication Date:
June 06, 2019
Filing Date:
November 28, 2018
Export Citation:
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Assignee:
NAGANO AUTOMATION CO., LTD. (401 Shimomaruko, Ueda-shi Nagano, 06, 〒3860406, JP)
International Classes:
B29C65/02; H01M2/02
Foreign References:
JP2011181390A2011-09-15
JP2009166487A2009-07-30
JP2003170499A2003-06-17
JP2013082489A2013-05-09
JP2012044145A2012-03-01
JP2011181390A2011-09-15
Attorney, Agent or Firm:
IMAI, Akira (Nihonseimei Matsumotoekimae Bldg. 8th Floor, 4-20 Chuo 1-chome, Matsumoto-sh, Nagano 11, 〒3900811, JP)
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