Title:
MEMBER, MANUFACTURING METHOD OF SAID MEMBER, AND ELECTRONIC COMPONENT PROVIDED WITH SAID MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/136537
Kind Code:
A1
Abstract:
This member is provided with a resin substrate obtained by injection molding using a general resin-containing material that is not a resin-containing material including a soluble filler and a substance serving as a catalyst nucleus, and this member, provided with a conducting layer, is characterized by being provided with a substrate obtained from a molded product of the resin-containing material and having a thin portion of thickness 0.3 mm or less, and with a conducting layer formed on the surface of the thin portion.
Inventors:
KANNO HIROYUKI (JP)
TAGUCHI YOSHIHIRO (JP)
YAMAI TOMOYUKI (JP)
KOIKE MASAHIRO (JP)
TAGUCHI YOSHIHIRO (JP)
YAMAI TOMOYUKI (JP)
KOIKE MASAHIRO (JP)
Application Number:
PCT/JP2016/054478
Publication Date:
September 01, 2016
Filing Date:
February 16, 2016
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD (JP)
International Classes:
C23C18/20; B32B15/08; H01F27/36; H05K9/00
Domestic Patent References:
| WO2012046651A1 | 2012-04-12 |
Foreign References:
| JP2003213437A | 2003-07-30 | |||
| JP2007231362A | 2007-09-13 | |||
| JP2009164575A | 2009-07-23 | |||
| JP2011187895A | 2011-09-22 | |||
| JP2009263700A | 2009-11-12 | |||
| JP2006336099A | 2006-12-14 |
Attorney, Agent or Firm:
OKUBO, KATSUYUKI (JP)
Katsuyuki Okubo (JP)
Katsuyuki Okubo (JP)
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