Title:
MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/188480
Kind Code:
A1
Abstract:
A member for a semiconductor manufacturing device according to the present invention is such that projections for wafer mounting are provided on the surface of an AlN ceramic substrate. The portion of the AlN ceramic substrate on which projections are not provided has a surface layer region from the surface to a prescribed depth and a base material region below the surface layer region. The prescribed distance is 5 µm or less. The oxygen content of the surface layer region is higher than the oxygen content of the base material region.
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Inventors:
OGISO YUSUKE (JP)
Application Number:
PCT/JP2022/038413
Publication Date:
October 05, 2023
Filing Date:
October 14, 2022
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/683; C04B35/581
Foreign References:
| JP6960260B2 | 2021-11-05 | |||
| JP2012119378A | 2012-06-21 | |||
| JP2006064992A | 2006-03-09 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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