Title:
MEMORY DEVICE WITH EMBEDDED SIM CARD
Document Type and Number:
WIPO Patent Application WO/2019/169543
Kind Code:
A1
Abstract:
A memory device (100) may include a PCB (102) insertable in the mobile device (400). The PCB (102) may include a first chip (104); a second chip (114); a first contact (116) electrically coupled with the first chip (104), to provide a first communication interface between the first chip (104) and the mobile device (400); and a second contact (118) electrically coupled with the second chip (114), to provide a second communication interface between the second chip (114) and the mobile device (400). The first and second communication interfaces may provide for respective communications between the micro SD device and the mobile device (400), and between the SIM card and the mobile device (400), at the same time, when the PCB (102) is removably coupled with the mobile device (400).
Inventors:
SHENG XIAOFENG (CN)
Application Number:
PCT/CN2018/078112
Publication Date:
September 12, 2019
Filing Date:
March 06, 2018
Export Citation:
Assignee:
INTEL CORP (US)
SHENG XIAOFENG (CN)
SHENG XIAOFENG (CN)
International Classes:
H01R13/6581
Foreign References:
| US20170093057A1 | 2017-03-30 | |||
| US20160218467A1 | 2016-07-28 | |||
| US20110124229A1 | 2011-05-26 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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