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Patent Searching and Data


Title:
MEMORY AND MEMORY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/155717
Kind Code:
A1
Abstract:
The present application discloses a memory and a memory manufacturing method. The retention properties and endurance of the memory can be improved, a read window is increased, and the device consistency of multiple memories in a storage array under the condition that the multiple memories use a two-dimensional material is improved. The memory comprises: a two-dimensional material layer and a first conductor layer; a ferroelectric layer, located between the two-dimensional material layer and the first conductor layer; a dielectric layer, located between the two-dimensional material layer and the ferroelectric layer; and a source and a drain, electrically connected to two ends of the two-dimensional material layer, respectively.

Inventors:
WANG XINRAN (CN)
LUO SHIJIANG (CN)
YU ZHIHAO (CN)
NING HONGKAI (CN)
XIE YUNONG (CN)
TANG WENTAO (CN)
ZHAO JUNFENG (CN)
Application Number:
PCT/CN2023/074977
Publication Date:
August 24, 2023
Filing Date:
February 08, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H10B51/00; H10B51/30
Foreign References:
CN110943128A2020-03-31
US20200303417A12020-09-24
CN108417636A2018-08-17
CN112038406A2020-12-04
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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